Lenovo (beijing) Limited

Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Lenovo Software Ltd.

Beijing Boe Technology Development Co., Ltd.

Beijing Youzhuju Network Technology Co., Ltd.

Beijing Boe Technology Co., Ltd.

Beijing Boe Chatani Electronics Co., Ltd.

Ting Tian

Shuqian Dou

Zhiqiang Fan

Dayong Zhou

Xiaoliang Fu

Yongjie Han

Yu Liu

Liguang Deng

Ming Zhai

Dong Zhang

Yawen Zhang

Youcai Yang

Zhongjun Wang

Taesung Kang

Jinge Zhao

Xintong Ding

Jian Wang

Jun Cheng

Jinyu Li

Yanjun Liu

Hyungkyu Kim

Pan Guo

Jia Meng

Xin He

Tangbo Jing

Ziran Li

Xiaoliang Guo

Jui-Chan Fan

Meijuan An

Bing Gao

Jeng-Ming Lai

Huanhuan Xue

Puyu Yao

Dong Yang

Zheran Li

Lianpei Zhang

Embodiments of the disclosure provide a cooling system including an air cooling part including a first cooler and a first circulation pipeline, the first cooler being configured to cool a coolant inside it with an external liquid, and the first circulation pipeline including a first liquid outlet pipe and a first liquid return pipe; a liquid cooling part including a second cooler and a second circulation pipeline, the second cooler being configured to cool a coolant inside it with an external gas, and the second circulation pipeline including a second liquid outlet pipe and a second liquid return pipe; and a guide assembly connected between the first circulation pipeline and the second circulation pipeline.

Air-liquid cooling system using seasonal temperature differences

A heat dissipation device includes a vapor chamber including a heat absorption plate body, a vacuum cavity, and a heat dissipation area arranged in sequence. The heat absorption plate body is configured to be connected to a heat generation device. A three-dimensional heat dissipation structure is disposed in the vacuum cavity. A gap exists between an end of the heat dissipation structure and an inner wall of the vacuum cavity. A capillary structure is provided at the inner wall of the vacuum cavity and the three-dimensional heat dissipation structure. The capillary structure is configured to accommodate heat dissipation liquid. The heat dissipation area is configured to reduce a temperature of heat dissipation vapor corresponding to the heat dissipation liquid.

Heat dissipation device and electronic apparatus

A heat dissipating structure includes a cold plate configured to exchange heat with a heat dissipating device; a liquid pipe disposed at both ends of the cold plate, the liquid pipe being configured to transport heat conducting liquid; and a deformation structure configured in the liquid pipe and located at a position corresponding to the cold plate, wherein the deformation structure deforms as an ambient temperature changes. The deformation structure is configured in the heat dissipating structure to manage the flow rate of the heat conducting liquid. The deformation structure deforms at different ambient temperatures. Based on a relationship between the temperature and a deformation coefficient, the flow rate of the heat conducting liquid flowing through the liquid pipe can be controlled for different temperatures. Thus, a desired heat dissipating capacity can be provided to the heat dissipating device to satisfy the needs of users.

Heat dissipating structure

A heat dissipation device includes: a rigid tube, including a first cavity; a first capillary structure, at least a portion of the first capillary structure being positioned within the first cavity; a flexible tube, including a second cavity, the flexible tube being more flexible than the rigid tube; and a second capillary structure, at least a portion of the second capillary structure being positioned within the second cavity, wherein the heat dissipation device is deformable via the flexible tube.

Heat dissipation device and electronic equipment

A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell. Spectrum drift time of optical signal propagated in optical signal propagation module is variable as refractive index of liquid crystal molecules in liquid crystal cell changes; optical signal transmitting module in rotational speed determining module transmits optical signal to optical signal propagation module; optical signal receiving module in rotational speed determining module receives optical signal propagated by optical signal propagation module and analyzes spectrum to determine rotational speed.

Rotational speed sensor, manufacturing method thereof, driving method thereof and electronic device

This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

Light-emitting diode chip, method for fabricating the same, backlight module, and display device

An evaporative cooling system having a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device. The heat dissipating device comprises a second medium, and the evaporator is configured to receive heat from the heat conducting device to heat the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device.

Evaporative cooling system

The present disclosure provides a heat dissipation system, including: a coolant and a convection accelerator. The coolant is configured to contact at least a portion of the heat generating device; the convection accelerator is disposed in a predetermined region surrounding the heat generating device, configured to accelerate a flow of the coolant surrounding the heat generating device.

Heat dissipation system

The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.

Acceleration sensor

A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.

Method for manufacturing micro light-emitting diode array substrate

The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.

Fingerprint sensor, display apparatus, method of detecting a fingerprint, and method of fabricating a fingerprint sensor

A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.

Device for fingerprint recognition, manufacturing method therefor, and electronic apparatus

A light emitting diode device, an array substrate and a display device. The light emitting diode device includes a substrate, a first sub-light emitting unit disposed on the substrate, and a second sub-light emitting unit disposed on a side of the first sub-light emitting unit away from the substrate. The first sub-light emitting unit includes a first semiconductor layer of a first conductivity type, a first light emitting layer, and a second semiconductor layer of a second conductivity type which are each disposed successively in a direction away from the substrate. The second sub-light emitting unit includes the second semiconductor layer, a second light emitting layer, and a third semiconductor layer of the first conductivity type. Each layer is disposed successively in the direction away from the substrate. The first conductivity type is different from the second conductivity type.

Light emitting diode device, array substrate and display device

A water-cooled server and an electronic device are provided. The water-cooled server comprises a cooling main tubing, wherein the cooling main tubing guides cooling water; a drainage branch tubing operatively coupled to cooling main tubing; a piston having a first end disposed in the drainage branch tubing and a second end disposed in the cooling main tubing, wherein the first end drives the second end to a first position under pressure of the cooling water to prevent the second end from plugging the cooling main tubing; and an elastic member operatively coupled to the piston, wherein the elastic member drives the second end of the piston to move to a second position to plug the cooling main tubing. An elastic force applied to the piston by the elastic member is smaller than maximum pressure applied to the piston by the cooling water.

Water-cooled server and electronic device

A manufacturing method of a light emitting diode device and a light emitting diode device are provided. The manufacturing method of the light emitting diode device includes: forming a light emitting lamination layer on a base substrate, the light emitting lamination layer including a first semiconductor layer, a first light emitting layer, a second semiconductor layer, a second light emitting layer and a third semiconductor layer sequentially formed on the base substrate; dividing the light emitting lamination layer to form a plurality of light emitting units spaced from each other, each light emitting unit including a first area and a second area spaced from each other; and removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit, and the second area being used for forming a second sub light emitting unit.

Manufacturing method of light emitting diode device and light emitting diode device having light emitting units with each light emitting unit including second sub light emitting unit in tandem with first sub light emitting unit

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Beijing, China

Ting Tian