Ii-vi Delaware, Inc.

Shanghai Huahong Grace Semiconductor Manufacturing Corporation

Ting Shi

Shao Jun Yu

Wei Peng Nian

Cheng Jie Dong

Jin Jiang

You Ji Liu

Wei Zhang

Hui Calvin Yang

Feng Wang

Tao Sun

Lei Xiong

Pei Xi

Zhenxing Zhang

Qing Qian

Hui Juan Yan

Bing Qiu

Jianpeng Wang

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.

Fiber optics printed circuit board assembly surface cleaning and roughening

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

Surface mounting techniques for fiber optics printed circuit board assemblies using metal coatings and tabs

In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.

Electrical coupling assemblies and methods for optoelectronic modules

The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.

A method of forming a micro-electro-mechanical systems (MEMS) device includes: providing a substrate; forming a tantalum nitride (TaN) layer on the substrate; forming a dielectric anti-reflective coating (DARC) layer on the TaN layer; coating photoresist on the DARC layer and etching the DARC: and TaN layers to form a trench; performing intensified ashing and wet cleaning processes to remove the photoresist and the DARC layer. The DARC layer can prevent the formation of tantalum-containing polymeric substances from a reaction between the TaN layer and the photoresist during the intensified ashing process.

Methods of forming MEMS device

Growing community of inventors

Shanghai, China

Ting Shi