Wuhan Choice Technology Co., Ltd.

Yangtze Memory Technologies Co., Ltd.

Ting Li

De Wu

Junxing Su

Shuhang Liao

Yu Wang

Yi Wang

Huangpeng Zhang

Shiyang Yang

Huamin Cao

Xu Hou

A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.

Packaging film and preparation method thereof, and filter chip packaging method

The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In, addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.

Composition, adhesive film and chip packaging structure

Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.

Adhesive, die attach film and preparation method therefor

Aspects of the disclosure provide a semiconductor memory device. The semiconductor memory device includes a memory cell array and peripheral circuitry coupled with the memory cell array. The memory cell array includes a plurality of memory cells. The peripheral circuitry includes programmable logic circuit that is configured, after the semiconductor memory device is powered on, to perform logic functions.

Flash memory device with programmable logic circuit

Growing community of inventors

Wuhan, China

Ting Li