Elo Touch Solutions, Inc.

Te Connectivity Corporation

Te Connectivity Solutions Gmbh

Te Connectivity Services Gmbh

Tyco Electronics (shanghai) Co., Ltd.

Te Connectivity Germany Gmbh

Tyco Electronics Corporation

Other

Measurement Specialties, Incorporated

Ittelfuse, Inc.

Tyco Electronics UK Ltd

Touch Panel Systems, K.k.

Ting Gao

Joel Christopher Kent

Kavitha Bharadwaj

Daniel H Scharff

Vijay Daga

Yoshikazu Tanaka

Sunny Sethi

Lei Wang

James L Aroyan

Jaydip Das

Jeffrey T Haller

Dejie Tao

Martin William Bayes

James J Toth

Timothy O Avery

Chad William Morgan

Andre Martin Dressel

Zhongxi Huang

Megan Hoarfrost Beers

Yiliang Wu

John Joseph Consoli

Timothy Robert Minnick

Helge Schmidt

Michael J Sailor

David Bruce Sarraf

Vincent M Wong

David Wayne Helster

Yang Yang Li

Jiankun Zhou

Miguel A Morales

Lizhang Yang

Soenke Sachs

Jing Wu

Natasha V Kachenko

Marco Wolf

Erling Hansen

Jialing Wang

Richard B Lloyd

Henry Paul S Cervantes

Vishrut Vipul Mehta

James Zeigler

Philip Singer

Rodney Ivan Martens

Frederique Cunin

Mario G Sepulveda

Jamie R Link

Quentin F Polosky

Mark Wartenberg

Sreeni Kurup

Nicola Pugliano

Jonathan Tran

Lananh Pham

Gokce Gulsoy

Frank Schabert

Megan L Hoarfrost

Mark F Wartenberg

Yilang Wu

Diane G Bigler

Jorge G Loayza

Min Zheng Haeberle

Quentin Francis Polosky

Kenneth Seufer

Mei Dong

James Aroyan

Jorge Loayza

Timothy Avery

Yoshikazu c/o Touch Panel Systems KK Tanaka

Jennifer L Robison

An electrical connector including a housing defining an interior cavity and extending from a mounting end to an engagement end, and at least one signal component disposed within the interior cavity of the housing. The housing is formed from a conductive composite material and engages the at least one signal component to shield the interior cavity.

High speed connector with moldable conductors

A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

Hybrid silicone composite for high temperature applications

A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ. A process of forming such printable non-curable thixotropic hot melt composition is described.

Printable non-curable thixotropic hot melt composition

A printable non-curable thixotropic hot melt composition is described. The composition comprises non-curable holt melt waxes transformed into a thixotropic composition by the use of thickeners. The thickeners can be added separately to the hot melt wax or formed in-situ, either before or after application to the substrate. A process of forming such printable non-curable thixotropic hot melt composition is described.

A dispensable grease sealant includes a base component in an amount of 50 wt % or more, based on a total weight of the sealant, and a thickener. The base component is selected from a group including a silicone wax, a liquid rubber, and a combination thereof.

Dispensable grease sealants, method for producing same, crimp connection, method for producing same, and use of the dispensable grease sealants

A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.

Assembly and method for sealing a bundle of wires

The present invention relates to use of an enhanced performance ultraconductive copper composite cylindrical conduit. The ultraconductive copper composite cylindrical conduit has enhanced RF conductivity.

Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials

A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.

A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

Silicone composite for high temperature applications

A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa&#xb7;s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.

Compressible element for a sensor assembly

A fluid sensing system includes a microfluidic chip, multiple sensors, and a communication device. The microfluidic chip includes at least one microfluidic channel extending a length through the microfluidic chip. The microfluidic chip is fluidly connected to a process fluid such that a fluid sample from the process fluid flows through the at least one microfluidic channel. The multiple sensors are operatively connected to the at least one microfluidic channel of the microfluidic chip. The multiple sensors are configured to monitor multiple different properties of the fluid sample within the at least one microfluidic channel. The communication device is operatively connected to the multiple sensors. The communication device is configured to receive data parameters representative of the multiple different properties of the fluid sample from the multiple sensors and wirelessly transmit the data parameters to a remote location.

Fluid sensing system

An acoustic touch apparatus is provided that includes a substrate capable of propagating surface acoustic waves, such as Rayleigh-type or Love-type waves. The substrate has a front surface, a back surface, and a curved connecting surface formed between the front surface and the back surface. The apparatus also includes at least one acoustic wave transducer and at least one reflective array, the acoustic wave transducer and the reflective array behind the back surface of the substrate. The acoustic wave transducer is capable of transmitting or receiving surface acoustic waves to or from the reflective array. The reflective array is capable of acoustically coupling the surface acoustic waves to propagate from the back surface and across the front surface via the curved connecting surface. Various types of acoustic touch apparatus with edge sensitive touch functions can be provided, according to specific embodiments.

Bezel-less acoustic touch apparatus

A silicon oil sensor has a conductive layer made of an organic silicone polymer doped with conductive particles.

Silicon oil sensor

Growing community of inventors

Palo Alto, CA, United States of America

Ting Gao