Dell Products Inc.

Acer Inc.

Ting-Chiang Huang

Qinghong He

Wen-Neng Liao

Shu-Yu Jiang

Ching-Lung Cheng

Tse-An Gino Chu

Tung-Yi Chen

Chien-Yi Juan

Sung-Feng Chen

Tung-Ho Shih

Ying-Chi Ma

Yo-Huang Chang

Woei Xiong Soo

Chen-Nan Cheng

Po-I Huang

An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.

Dual parallel path cooling system for dual socket information handling systems

Managing PCIe slots, including identifying a table, stored at a database, indicating, for each PCIe card, a number of PCIe slots to be designated as inaccessible to other PCIe cards; detecting coupling of a particular PCIe card to a particular PCIe slot; accessing, in response to detecting the coupling of the particular PCIe card to the particular PCIe slot, the table; determining, based on the accessing, that the table includes data indicating the particular PCIe card; identifying, based on determining that the table includes data indicating the particular PCIe card, the number of PCIe slots adjacent to the particular slot to be designated as inaccessible to other PCIe cards; adjusting, based on the number of PCIe slots adjacent to the particular slot to be designated as inaccessible to other PCIe cards, a power state of one or more PCIe slots adjacent to the particular PCIe slot to an off-power state.

Managing peripheral component interconnect express slots of an information handling system

Systems and methods for intelligent fan identification are described. In some embodiments, an Information Handling System (IHS) may include: an embedded controller (EC); and a memory coupled to the EC, the memory having program instructions stored thereon that, upon execution by the EC, cause the IHS to: detect a cooling fan configuration issue; determine that a number of cooling fans in the IHS has not changed between a previous configuration and a current configuration; and in response to the determination, abstain from identifying the cooling fan configuration issue as a cooling fan error.

System and methods for intelligent fan identification including fan quantity change detecting during POST

A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.

Fin stack for processor cooling

A hinge assembly used for connecting between an arm and a display of an electronic device is provided. The display has a back surface. The hinge assembly includes a first hinge and a second hinge. The first hinge is pivoted between the display and the arm, such that the display is rotated relative to the arm. The second hinge is assembled to the first hinge. The second hinge has at least one positioning surface leaning against the back surface of the display. An electronic device using the hinge assembly is also provided.

Hinge assembly and electronic device using the same

Growing community of inventors

Taipei, Taiwan

Ting-Chiang Huang