Inventec Corp.

Inventec (pudong) Technology Corporation

First International Computer, Inc.

Ting-Chiang Huang

Sheng-Jie Syu

Shaw-Fuu Wang

Feng-Ku Wang

Li-Ting Wang

Wei-Yi Lin

Shih-Chen Shen

Te-Chuan Wang

Sung Nien Du

Hua-Feng Chen

Han-Tun Chen

Kuang-Chung Sun

Chiun-Peng Chen

Fei-Kai Hsiao

Chih-Kuang Chung

Ben Hung-Ping Shen

Chei-Ju Tsai

A fan structure used for connecting with a plate body includes a main body, a fan blade, a sliding member and a locating member. The main body has an accommodating space and an adjustment slot. The fan blade is pivotally disposed on the main body and is located inside the accommodating space. The sliding member has a base and a joining portion. The base is accommodated in the adjustment slot. The sliding member is joined to the plate body through the joining portion. The locating member is used for joining the sliding member and the main body together, so as to fix the relative position of the sliding member and the main body.

Fan structure and casing structure

An electronic device comprises a back plate, a fan and a coupling element. The fan includes a supporting base, a cover and a fan blade. The cover is disposed on the supporting base to form a fan blade accommodating space, the fan blade is disposed inside the accommodating space and is pivotally connected to the supporting base. In addition, the supporting base includes a coupling hole which is disposed inside the accommodating space. The coupling element passes through the coupling hole in order to have the supporting base installed on the back plate. Whereby, a bottom area of the fan is reduced by having both the coupling hole and the fan blade disposed inside the accommodating space, so that less space of circuit layout for a circuit board is occupied by the fan.

Fan structure and electronic device applied with the same

A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

Heat dissipating module

An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Electronic apparatus

An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Electronic apparatus with improved heat dissipation

A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.

Heat sink structure

An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.

Electronic device and heat sink thereof

A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.

A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.

Heat dissipation device

A heat dissipation module including a supporting frame, a driver, a linkage, a first magnet and a plurality of magnetic blades is provided. The supporting frame has a chute. Moreover, one end of the linkage has a protrusion passing through the chute. The other end of the linkage is connected to the driver. The first magnet is disposed on the protrusion. In addition, the repelling magnetic blades are pivoted on the supporting frame. The outermost magnetic blade faces the first magnet and they repel each other.

Heat dissipation module

A swing type fan including a frame, a motor, at least one blade, at least one first magnetic element and at least one second magnetic element is provided. The motor is fixed to the frame and has a shaft passing through the frame. The blade is disposed between the shaft and the frame and has a first side and a second side opposite to the first side. The first side of the blade is connected to the frame. The first magnetic element is disposed on the blade and is located between the first side and the second side of the blade. The second magnetic element is connected to the shaft and is corresponding to the first magnetic element. The second side of the blade swings via a magnetic force between the first magnetic element and the second magnetic element as the shaft drives the second magnetic element to rotate.

Swing type fan

A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation device has at least one coil and at least one vibrating sheet. The coil is used to receive the intermittent power source to produce a magnetic field. One end of the vibrating sheet is fixed, and the other end is suspended over the coil. The suspended end flutters periodically under the magnetic force of the intermittent magnetic field, so as to produce an airflow.

An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.

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Taipei, Taiwan

Ting-Chiang Huang