Applied Materials, Inc.

Tina Tsong

Walter R Merry

Fernando Silveira

Chetan Mahadeswaraswamy

Brad L Mays

Duy D Nguyen

Shane C Nevil

Yashaswini Pattar

Kartik Ramaswamy

Douglas A Buchberger, Jr

Hamid Noorbakhsh

Chunlei Zhang

Douglas Buchberger

Hamid Tavassoli

Sergio Fukuda Shoji

Xiaoping Zhou

Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.

Feedforward temperature control for plasma processing apparatus

Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.

Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow

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San Jose, CA, United States of America

Tina Tsong