Intel Corporation

Tina C Zhong

Jason Sandri

Kenneth P Griesser

Lori R Borger

Joshua B Fryman

Malay Trivedi

Ankit More

Jason M Howard

Robert Pawlowski

Chih-Cheh Chen

Russell J Wunderlich

Sriram Aananthakrishnan

Vincent Cave

Shaden Smith

Samkit Jain

Sowmya Pitchaimoorthy

Bharadwaj Krishnamurthy

Sivakumar Radhakrishnan

Anand K Enamandram

Jayasekhar Tholiyil

Disclosed embodiments relate to an improved memory system architecture for multi-threaded processors. In one example, a system includes a system comprising a multi-threaded processor core (MTPC), the MTPC comprising: P pipelines, each to concurrently process T threads; a crossbar to communicatively couple the P pipelines; a memory for use by the P pipelines, a scheduler to optimize reduction operations by assigning multiple threads to generate results of commutative arithmetic operations, and then accumulate the generated results, and a memory controller (MC) to connect with external storage and other MTPCs, the MC further comprising at least one optimization selected from: an instruction set architecture including a dual-memory operation; a direct memory access (DMA) engine; a buffer to store multiple pending instruction cache requests; multiple channels across which to stripe memory requests; and a shadow-tag coherency management unit.

Memory system architecture for multi-threaded processors

Examples may include chipsets, processor circuits, and a system including chipsets and processor circuits. The chipsets and processor circuits can be coupled together via side band interconnect. The chipsets and processor circuits can be coupled together dynamically, during runtime using the side band interconnects. A chipset can send control signals for other chipsets and/or receive control signals from processor circuits via the side band links to dynamically coordinate the chipsets and processor circuits into systems.

External resource discovery and coordination in a data center

Embodiments disclosed herein relate to coordinated system boot and reset flows and improve reliability, availability, and serviceability (RAS) among multiple chipsets. In an example, a system includes a master chipset having multiple interfaces, each interface to connect to one of a processor and a chipset, at least one processor connected to the master chipset, at least one non-master chipset connected to the master chipset, and a sideband messaging channel connecting the master chipset and the non-master chipsets, wherein the master chipset is to probe a subset of its multiple interfaces to discover a topology of connected processors and non-master chipsets, and use the sideband messaging channel to coordinate a synchronized boot flow.

Method to coordinate system boot and reset flows and improve reliability, availability and serviceability (RAS) among multiple chipsets

Examples include an apparatus having a communications link bridge coupled to a plurality of processors to control connections between each of the plurality of processors and the apparatus; and a controller coupled to a memory over a memory interface to control access to the memory, the controller configured to, during system initialization, selectively bypass a token requirement for access to the memory for read requests by processors and allow multiple processors to read the memory concurrently.

Micro-architectural techniques to minimize companion die firmware loading times in a server platform

In one embodiment, the present invention includes a semiconductor die such as a system on a chip (SoC) that includes a logic analyzer with a built-in trace buffer to store information communicated between on-die agents at speed and to provide the information to an off-die agent at a slower speed. Other embodiments are described and claimed.

On-die logic analyzer for semiconductor die

Growing community of inventors

Portland, OR, United States of America

Tina C Zhong