Rohm & Haas Electronic Materials LLC

Tina Aoude

Michael K Gallagher

Robert K Barr

David Fleming

Michelle Bowerman Riener

Colin Hayes

Herong Lei

Colin O'Mara Hayes

David Louis Danza

Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.

Methods of manufacturing printed wire boards

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Medway, MA, United States of America

Tina Aoude