Qualcomm Incorporated

Tin Tin Wee

Thomas Clark Bryan

Luverne Ray Peterson

Alvin Leng Sun Loke

Stephen Knol

Gregory Lynch

Reza Jalilizeinali

Yue Li

Arun Kumar Kodigenahalli Venkateswar

Sunil Sukumarapillai

Trilochan Sahoo

Jacob Schneider

Mohammed Mizanur Rahman

Kenneth Dubowski

Scott Powers

Andrew Tohmc

Subrahmanya Pradeep Morusupalli

Gregory Francis Lynch

Stephen Robert Knol

A die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain contact formed over a second portion of the one or more fins, wherein the first source/drain contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first source/drain contact to the first metal line, and a second via connecting the first source/drain contact to the second metal line, wherein the second via lies within the extended portion of the first source/drain contact.

Layout technique for middle-end-of-line

In certain aspects of the disclosure, a die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain contact formed over a second portion of the one or more fins, wherein the first source/drain contact includes an extended portion that does not overlap the one or more fins. The die also includes first and second metal lines formed from a first metal layer, wherein the first and second metal lines are spaced apart. The die further includes a first via connecting the first source/drain contact to the first metal line, and a second via connecting the first source/drain contact to the second metal line, wherein the second via lies within the extended portion of the first source/drain contact.

Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receivesdata bits during operation would havetransceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path.

Systems and methods for wafer-level loopback test

A die-to-die data transmitter is disclosed with a pull-up one-shot circuit and a pull-down one-shot circuit, each forming a delay circuit that determines a variable preemphasis period.

Delay line for one shot pre-emphasis

A multi-rank memory bus architecture is provided in which an active DRAM is unterminated and an inactive DRAM terminates to increase the data eye width at the active DRAM.

Termination schemes for multi-rank memory bus architectures

Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receives 32 data bits during operation would have 32 transceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path.

A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.

Programmable pad capacitance for supporting bidirectional signaling from unterminated endpoints

Circuits for die-to-die clock distribution are provided. A system includes a transmit clock tree on a first die and a receive clock tree on a second die. The transmit clock tree and the receive clock tree are the same, or very nearly the same, so that the insertion delay for a given bit on the transmit clock tree is the same as an insertion delay for a bit corresponding to the given bit on the receive clock tree. While there may be clock skew from bit-to-bit within the same clock tree, corresponding bits on the different die experience the same clock insertion delays.

Systems and methods for clock distribution in a die-to-die interface

Methods, systems, and circuits for providing reception and capture of data using a mismatched impedance and an equalizer to save power are disclosed. A data receiver in communication with a transmission line, the data receiver having a termination impedance that is mismatched with respect to a characteristic impedance of the transmission line; and an equalizer in communication with the data receiver, the equalizer configured to receive a channel-transmitted data signal from the data receiver and to re-shape the signal to reduce distortion RC attenuation; wherein the circuit is configured to selectably operate in a first mode wherein the termination impedance is matched with respect to the characteristic impedance of the transmission line and a second mode wherein the termination impedance is mismatched with respect to the characteristic impedance of the transmission line and the signal is not recoverable but for the equalizer.

Circuits and methods providing high-speed data link with equalizer

A circuit includes a first die having a first array of exposed data nodes, and a second die having a second array of exposed data nodes, wherein a given data node of the first array corresponds to a respective data node on the second array, further wherein the first array and the second array share a spatial arrangement of the data nodes, wherein the first die has data inputs and sequential logic circuits for each of the data nodes of the first array on a first side of the first array, and wherein the second die has data outputs and sequential logic circuits for each of the data nodes of the second array on a second side of the second array, the first and second sides being different.

Systems and methods for providing data channels at a die-to-die interface

Circuits and methods for Data Bus Inversion (DBI) are provided. In one example, the immediately previous value of the DBI bit affects the next value of the DBI bit. Specifically, in some instances, the value of the DBI bit is held to the immediately previous value of the DBI bit to limit the total number of transitions on a data bus.

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San Diego, CA, United States of America

Tin Tin Wee