Bae Systems Information and Electronic Systems Integration Inc.

Timothy Whalen

Santos H Nazario-Camacho

Daniel S Sherick

Keith K Sturcken

Michael J Shaw

John A Hughes

Geoffrey K Torrington

Michael P Mitchell

Alan M Berard

A method for fabricating an integrated heat pipe is disclosed. The integrated heat pipe includes a porous wick structure, a solid conducting structure, and an integrated part. In a CAD model, the porous wick structure is represented as a simple solid having a finite amount of mechanical interference; the solid conducting structure and the integrated part are represented as simple solids. After incorporating the CAD model into a 3D-printer build file, 3D-printer parameters representing the porous wick structure of the integrated heat pipe are assigned to a porous region component model within the 3D-printer build file, and standard 3D-printer parameters representing the solid conducting structure and the integrated part are assigned to a solid region component model within the 3D-printer build file. The 3D-printer build file is utilized to print the integrated heat pipe on a 3D printer.

Method for fabricating integrated heat pipes via additive manufacturing

An apparatus for cooling electronic devices to be used in the vacuum of space is described. a window frame is provided as packaging for an electronic device having a substrate and a chip. The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip. The window frame is hermetically sealed to the backside of the chip. The window frame is also welded to a kovar ring located on the backside of the chip to provide a hermetic seal between the window frame and the substrate.

Method and apparatus for cooling electonic components

An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate has two sides, with an integrated circuit chip mounted on one side and many input/output pads mounted on the other side. Solder columns are attached between the input/output pads and the printed circuit board. A corner post is located at each corner of the column grid array package to secure the position of the ceramic substrate in relation to the printed circuit board.

Apparatus for providing mechanical support to a column grid array package

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Manassas, VA, United States of America

Timothy Whalen