Novellus Systems Incorporated

Miasole

Hanergy Holding Group Ltd.

Timothy W Kueper

Daniel R Juliano

Michael D Kilgore

Jimmy Lam

A Piers Newbery

Dan Ye

Jaime Onate

A method of making a sputtering target includes providing a backing structure, and forming a copper indium gallium sputtering target material on the backing structure by spray forming.

Method of making a CIG target by spray forming

A method of making a semiconductor device includes providing a web substrate, forming a first semiconductor layer of a first conductivity type over the web substrate, forming a second semiconductor layer of a second conductivity type over a first side of the first semiconductor layer, forming a first electrode layer over the second semiconductor layer, forming a handle web substrate over the first electrode layer, delaminating the web substrate from the first semiconductor layer after the step of forming the handle web substrate, where at least one opening extends through the first and the second semiconductor layers, and forming a second electrode layer over a second side of the first semiconductor layer such that the first and second electrode layers are in electrical contact with each other.

Semiconductor device and method of making thereof

A semiconductor workpiece processing system for treating a workpiece, such as a semiconductor wafer, is provided. A related operating control method is also provided. The system includes an electrostatic chuck configured to receive a workpiece, and a clamping voltage power supply coupled to the electrostatic chuck. The electrostatic chuck has a clamping electrode assembly, and the clamping voltage power supply is coupled to the clamping electrode assembly. The clamping voltage power supply includes a direct current (DC) voltage generator configured to generate a DC clamping voltage for the clamping electrode assembly, an alternating current (AC) voltage generator configured to generate an AC excitation signal for the clamping electrode assembly, and a processing architecture coupled to the clamping electrode assembly. The processing architecture is configured to analyze attributes of a workpiece presence signal obtained in response to the AC excitation signal, and, based on the attributes, verify proper/improper positioning of the workpiece relative to the electrostatic chuck.

Electrostatic chuck assembly with capacitive sense feature, and related operating method

In one embodiment, an electrostatic chuck includes a body having a top surface facing a wafer and a reflective coating over the top surface. The reflective coating is formed on areas of the top surface that do not contact a wafer so as to not appreciably affect the clamping function of the electrostatic chuck. The reflective coating helps raise the operating temperature of the wafer by reflecting heat radiated from the wafer back onto the wafer. In one embodiment, the reflective coating comprises a material that is relatively good in reflecting radiation in the infrared region.

Growing community of inventors

San Jose, CA, United States of America

Timothy W Kueper