Analog Devices,inc.

Timothy Spooner

David S Courage

Kieran P Harney

Nelson Kuan

Brad Workman

Michael W Judy

Xin Zhang

John R Martin

Peter Farrell

Lewis Long

Kevin H L Chau

Chetan Paydenkar

A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Stress mitigation in packaged microchips

A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Package having a plurality of mounting orientations

A wafer cap protects micro electromechanical system ('MEMS') structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

Method and device for protecting micro electromechanical systems structures during dicing of a wafer

An optical mirror module has an interface port that is spaced from a corresponding die. More specifically, the optical mirror module includes a substrate and a die having at least one mirror and circuitry to control the at least one mirror. The optical mirror module defines a plane that is substantially parallel to the die. The optical mirror module further includes the noted interface port, which is adapted to electrically couple the circuitry with a device external to the optical mirror module. As suggested above, the interface port is located on the substrate and spaced from the die on the plane.

Optical mirror module

A wafer cap protects micro electromechanical system (&ldquo;MEMS&rdquo;) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

Growing community of inventors

Dunstable, MA, United States of America

Timothy Spooner