Motorola Corporation

Timothy S Fisher

Michael I Petrites

Al Ocken

Alfred G Ocken

Nathan A Unterman

A one-piece electronic module assembly is formed from a substantially rectangular baseplate on which an insulating film is mounted to carry circuit components. An enclosed assembly is completed by initially providing a pair of major bend axes across the baseplate, and forming inwardly extending notches at selected locations along lengthwise edges of the baseplate. The baseplate is bent at the notches to form a front wall, a pair of sidewalls and tabs that overlap the sidewalls. The baseplate is then bent over on itself along the major bend axes and sealed, if necessary, to form a completed assembly.

Electronic module assembly and method of forming same

An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.

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Bensenville, IL, United States of America

Timothy S Fisher