Nanofoil Corporation

Reactive Nanotechnologies, Inc.

Indium Corporation of America

Timothy Ryan Rude

Omar Knio

Jesse E Newson

David Van Heerden

Michael V Brown

Alan Duckham

Jai S Subramanian

Ellen Heian

Timothy P Weihs

Ramzi Vincent

Ronald L Spraker

Etienne Besnoin

Yuping Lin

Somasundaram Valliappan

Ellen M Heian

Omar M Knio

A method for bonding an LED assembly () or other electronic package () to a substrate PCB containing a heat-sink (), which utilizes layers of reactive multilayer foil () disposed between contacts () of the electronic packageand the associated contact pads () on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (), together with an application of pressure, sufficient heat is generated between the contacts () and the associated contact pads () to melt adjacent bonding material () to obtain good electrically and thermally conductive bonds between the contactsand contact pads () without thermally damaging the electronic package (), heat-sensitive components () associated with the electronic package (), or other the supporting substrate PCB.

Method for low temperature bonding of electronic components

Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Reactive composite material structures with electrostatic discharge protection and applications thereof

A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.

Method for fabricating large dimension bonds using reactive multilayer joining

The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pressure on the two components in contact with the reactive multilayer foil via a compliant element, and initiating a chemical transformation of the reactive multilayer foil so as to physically join the at least two components. The invention also includes two components joined using the aforementioned method.

Methods and device for controlling pressure in reactive multilayer joining and resulting product

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Baltimore, MD, United States of America

Timothy Ryan Rude