Rudolph Technologies, Inc.

Velocity Image Processing LLC

Stella Alliance, LLC

Timothy Pinkney

Robert P Bishop

Methods and apparatus for inspection of electronic parts such as semiconductor wafers, high-density circuit boards, multi-layer substrates, chrome on glass masks, and other fine line products which compensates for reference misalignment. Conductor linewidth and space measurements are performed along the entire length of every conductor to sub-camera pixel, sub-micron accuracy in real time as the part is scanned. Billions of metrology measurements are also performed in real time to sub-micron accuracy. A self-learning automated method to extract measurement values from Computer Aided Design (CAD) files is described. This method automatically determines locations to perform these billons of operations within defined allowed manufacturing tolerances.

Compensating for reference misalignment during inspection of parts

A method and apparatus for optimizing inspection high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.

Focus adjustment for surface part inspection

Scanning operation with concurrent focus and inspection

A method and apparatus for optimizing high-speed optical inspection of parts using intelligent image analysis to determine optimal focus using high numerical aperture (NA) optics, achieve a superior signal-to-noise ratio, resolution, and inspection speed performance with very limited depth of field lenses.

Growing community of inventors

Cambridge, MA, United States of America

Timothy Pinkney