Saturn Electronics & Engineering, Inc.

Timothy Patterson

John Burke

Alex Lim Tiang Hock

A method for forming a fine-pitch flip chip assembly interconnects fine pitch devices after they have been connected to a carrier substrate. A die having a plurality of conductive sections, such as solder balls, is attached to a conductive layer of the substrate. An interconnect pattern is then formed in the conductive layer to connect the conductive sections and generate electronic functionality to the assembly. By forming the interconnect pattern after the device have been connected to the carrier, the invention provides precise alignment between the devices and the interconnect pattern without actually aligning the two components during the assembly process.

Traceless flip chip assembly and method

A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.

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Costa Mesa, CA, United States of America

Timothy Patterson