Hewlett-packard Development Company, L.P.

Timothy Michael Rau

Glenn Cochran Simon

Matthew Daniel Neumann

A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.

Modular data center

A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.

Frame having frame blades that participate in cooling memory modules

A cold plate has blades arranged to be interleaved with memory modules, with clips coupling blades to memory modules. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Cooling memory modules using cold plate blades coupled to the memory modules via clips

A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Growing community of inventors

Sacramento, CA, United States of America

Timothy Michael Rau