Laird Technologies Gmbh

Timothy M Wrona

Gerald Robert English

James D Pille

Daniel Jacklinski

Frame for shielding assembly

Frame for a shielding assembly

According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include portions alignable with and solderable to solder ball pads along a printed circuit board. A cover may be releasably attachable to, detachable from, and reattachable to the frame.

Frames for shielding assemblies and shielding assemblies including the same

A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.

Board level shield including an integrated heat sink

Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed generally between the substrate and the cover when the substrate is captured generally between the electrically-conductive member and the first protrusion. In addition, a compressive clamping force may be generated by the engagement of the first protrusion with the substrate and the compression of the electrically-conductive member. This compressive clamping force may mechanically retain the cover to the substrate, and also compress the electrically-conductive member against at least one electrically-conductive surface disposed on the substrate, to establish electrical conductivity therebetween that is sufficient for EMI shielding performance.

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Schaumburg, IL, United States of America

Timothy M Wrona