Intel Corporation

Timothy M Swettlen

Sanka Ganesan

Donald Tiendung Tran

Sandeep B Sane

Dong-Ho Han

Gary Baxter Long

Scott M Mokler

Kevin J Byrd

David I Amir

Arthur R Isakharov

Isaac Chang

Ai Ssa Chai

Jill D Murfin

Embodiments herein disclose techniques for electronic apparatuses including a printed circuit board (PCB) and an electromagnetic interference (EMI) shield for the PCB. An electronic apparatus may include a PCB with a plurality of layers including a ground layer. The PCB may include a cutout through the plurality of layers of the PCB. An EMI shield may be mounted to a bottom side of the PCB along an edge of the cutout, where the EMI shield may be coupled to the ground layer through an ohmic contact. The EMI shield may be flat. Other embodiments may also be described and claimed.

Electromagnetic interference (EMI) shield for a printed circuit board (PCB)

Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.

Shielding in electronic assemblies

The systems and methods described herein are directed to using a plurality of interface elements (e.g., sockets) and/or stud-bump elements embedded into board substrates (e.g., a motherboard) to enable the interchange of variable configuration components (e.g., electronic components, chips, and the like) that are mounted on package substrates having ball grid arrays (BGAs). In some aspects, this interchange can be accomplished while leaving the pre-existing board substrate design and various peripheral system components of the board substrate unchanged.

Systems and methods for replaceable bail grid array (BGA) packages on board substrates

Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Interconnect architecture with stacked flex cable

According to one embodiment a system is disclosed. The system includes a tester having a power supply, an integrated circuit device under test (DUT) and a transient compressor (TC) coupled between the tester and the power supply to stabilize power delivered to the DUT by injecting current into the path between the power supply and the DUT.

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Burlingame, CA, United States of America

Timothy M Swettlen