Xerox Corporation

Timothy M Minerd

David W Rall

Denis J Stemmle

Daniel Lee Carter

Alan Kenneth Robertson

Robert Michael Chapin

Ross E Schroll

James R Bryce

Lawrence P Lavery

Russell L Phelps

Robert E Crumrine

Benjamin D Brown

Larry R Barnard

A drive belt system comprises a drive belt that is conductive. The drive belt system further comprises ground coupling means, such as a conductive brush or rubbing material, arranged for coupling the drive belt to ground. As a result, arcing in the drive belt system is reduced.

Drive belt system arranged for reducing arcing

An input/output connector module for connecting input and output devices to a multi-wire bus having a first stage. The first stage electrically connects directly to the multi-wire bus, and a second stage is supported on the first stage and carries an IC chip. The second stage includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second stage further includes a substrate having positioning cavities for locating the second stage with respect to the first stage in a horizontal direction and the surface of the substrate includes cutout portions for locating the second stage with respect to the first stage in a vertical direction. The cutout portions are elongated strips along opposite sides of the substrate with one positioning cavity being semi-circular and disposed essentially in the middle of one of the elongated strips. The first stage includes an elongated, cylindrical member and pins in mating contact with the positioning cavities.

I/O interface device and connector module with dual locators

An interface connector device having two assemblies for interconnecting a plurality of input/output devices to a multi-wire bus. The first assembly is electrically connected directly to the multi-wire bus and the second is carried on the first assembly and supports an IC chip. The second assembly includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second assembly incorporates a single molded piece including a molded socket for receiving the IC chip, a set of molded pins adapted to receive conductive coatings for electrically connecting the input and output devices to the IC chip, and molded positioning elements for orienting the second assembly with respect to the first assembly.

Connector module with molded upper section including molded socket,

An interface connector device for interconnecting a plurality of input/output devices including a signal bus connected to a control and to the input/output devices for multiplexing the signals between the control and the input and output devices, the bus interconnecting a plurality of interface and connector devices, and each of the interface and connector devices including address recognition circuitry as well as programmable configuration selection logic to configure the connector device to respond to a variety of input/output devices. In addition, the signal bus and connector devices are adapted to recognize and convey various levels of signals, for example, different voltage levels representing control information, framing signals, and diagnostic command signals.

Integrated I/O interface device and connector module

A plurality of input/output connector modules are located along a time multiplex bus. Each module has a plurality of programmable cells comprised of digital components. Each cell can be electronically programmed to receive one bit of information. These bits of information are used by each module to determine the address and input/output configuration assumed by the module. Programming data is sent via a serial input data (SID) line to the programming cells. The SID line has a plurality of delays which are located between the modules. The delays allow all of the programming cells of one module to be programmed before the next module receives the data along the SID line. The delays are created by the intrinsic resistance of the SID line and capacitors connected to the SID line which cause a delay in the programming data. The SID line is also clamped to ground out the programming signals after each cell has been programmed.

Apparatus and method for electronically programming nodal identifications

A programmable connector module is equipped with a molded plastic base on which an IC chip is mounted. The plastic base is wired with programmable inputs which can be used to provide a logic 1 or a logic 0 to each input of the IC chip. Tabs or punch holes located on the plastic base can be broken to disconnect an input circuit from ground to allow a logic 1 to be programmed. Two inputs are used to program the configuration of the module and four inputs are used to program the address of the module. The programmable module can be positioned anywhere along a multiplex wire bus and is equipped with connectors for transmitting and receiving data to and from electrical loads along the bus.

Programmable connector module

A programmable integrated input/output connector module has a molded plastic base through which five bus wires extend. The molded base is equipped with channeled grooves into which five spring clips are housed and which make contact with a corresponding bus wire at the bottom of the molded base. One of the bus wires is a grounded bus wire to which a programmable packet is connected. A chip carrier having conductive traces is placed atop the spring clips so as to place the clips in compression while placing each conductive trace of the chip carrier in electrical contact with a corresponding one of the bus wires. An IC chip is fitted atop and electrically connected to the chip carrier. The programmable packet has six fingers which can be bent away from or left in contact with the chip carrier to selectively program the IC chip to a desired address and configuration. The programmable packet permits each chip carrier to be identical. Further, the spring clips are placed in compression by the chip carrier so that the spring clips urge the chip carrier out of the base upon disassembly of the module.

Programmable integrated input/output connector module and spring clip

A high contrast ratio sensor is provided by introducing a pair of photodetectors into the sensor circuitry. One of the detectors is a diffuse detector and the other is either a reflective or transmittance detector. The two photodetectors are connected in a manner to cause the diffuse detector output to subtract from the reflective (or transmissive) detector output. This subtraction of signals provides a high contrast ratio. In a first embodiment, a diffuse detector and a reflectance detector are located on the same side of the paper as the emitter light and in a second embodiment a diffuse detector and a transmittance detector are located on opposite sides of the paper to be sensed.

High contrast ratio paper sensor

In a document sheet feeding and registration apparatus for deskewing a document sheet relative to a desired copying position on a copier platen while feeding the document sheet onto the platen into said copying position, there is disclosed a method and apparatus including obtaining an electrical signal corresponding to the actual velocity of the document sheet being fed onto the platen, and actuating an automatic document sheet deskewing device at a precise actuating time occurring slightly before the document sheet reaches the copying position, so that the actuating time of said document sheet deskewing corresponds to the actual velocity of the document sheet. The electrical signal corresponding to the actual document sheet velocity may be obtained by counting the elapsed time between the actuation of first and second switches substantially spaced from one another along the document sheet path upstream of the copier platen. The actuating time of the document sheet deskewing device may be a resettable time delay count after the actuation of said second switch, which time delay count is resettable by a change in the counted time period between the actuation of said first and second switches. The automatic document sheet deskewing device may comprise a releaseable skew preventing document feeder releasing the document sheet at said actuating time to another feeder for briefly driving the document sheet into a registration aligning edge while freely allowing deskewing movement of the document sheet thereagainst after said actuating time.

Document deskewing system

A selective speed xerographic processor having a laser for exposing a photoreceptor at any one of a plurality of different printing rates in response to a video signal is characterized by including an adjustable optical attenuator and an adjustable electrical attenuator for coarsely and more precisely, respectively, normalizing the exposure process. The processor may be used to advantage as a printer for a facsimile systems offering a choice of several different document transmission times.

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Pittsford, NY, United States of America

Timothy M Minerd