Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Elevance Renewable Sciences, Inc.

Timothy M Champagne

Laxmisha Sridhar

Philip T Klemarczyk

Jonathan B Israel

XianMan Zhang

Benny E Jordan

Steven Alan Cohen

Zhe Wang

Thay A Ung

Jeffrey Leon

John Killoran

Yu Chen

Donde R Anderson

Laxmisha M Sridhar

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Cationically curable compositions with latent reducing agent demonstrating low cure temperature

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;) and the like (collectively, &#x201c;subcomponents&#x201d;), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Diene/dienophile couples and thermosetting resin compositions having reworkability

Various methods are provided for treating and reacting a metathesis feedstock. In one embodiment, the method includes providing a feedstock comprising a natural oil, chemically treating the feedstock with a metal alkoxide under conditions sufficient to diminish catalyst poisons in the feedstock, and, following the treating, combining a metathesis catalyst with the feedstock under conditions sufficient to metathesize the feedstock.

Methods for treating a metathesis feedstock with metal alkoxides

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Orange, CA, United States of America

Timothy M Champagne