International Business Machines Corporation

Timothy Lee Sharp

William Louis Brodsky

Thomas G Macek

James D Herard

George Joseph Shovlowsky

Jonathan David Reid

Mark Daniel Derwin

Daniel Peter Labzentis

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

Circuitized structure including flexible circuit with elastomeric member

A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e.g., encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e.g., copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or 'progressive') surface tensions successfully constrains the liquid material at least until solidification thereof occurs.

Circuitized substrate with material containment means and method of

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Berkshire, NY, United States of America

Timothy Lee Sharp