Hewlett-packard Development Company, L.P.

Hewlett-packard Company

Timothy L Michalka

Karl Joseph Bois

David W Quint

William S Worley, Jr

David B Hollenbeck

A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.

Printed circuit board substrate and method for constructing same

A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signal path layer is interposed between the first dielectric material and the second dielectric material. An adhesive layer is interposed between the first dielectric material and the second dielectric material such that the adhesive layer is substantially coplanar relative to the signal path layer.

A four-drop bus has each driver or receiver terminated at the characteristic impedance of Z . Each driver or receiver is connected to a segment of transmission line with a characteristic impedance of Z . Two of these segments are connected at a first point. The other two of these segments are connected at a second point. The first and second points are connected by a central transmission line with a characteristic impedance of Z /2.

Four-drop bus with matched response

Signal delay and skew within an integrated circuit are minimized when 1) signals are distributed to distant points of an integrated circuit via a layer of its package, and 2) traces in the package layer are etched and treated as transmission lines. As disclosed herein, a signal is driven through a first connection between an integrated circuit and an integrated circuit package layer. The signal is then distributed to one or more additional connections between the integrated circuit and the integrated circuit package layer, by means of point-to-point transmission lines formed in the integrated circuit package layer, each of the transmission lines being terminated at one or both ends by impedances which are substantially matched to the characteristic impedance of the transmission line to which they are attached. The signal is then received into the integrated circuit through the one or more additional connections between the integrated circuit and the integrated circuit package layer.

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Ft. Collins, CO, United States of America

Timothy L Michalka