International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Timothy L McMillan

David B Johnson

James Dorance Gerken

David George Lund

Matthew Stephen Doyle

John Richard Dangler

Don Alan Gilliland

Tyler Jandt

Thomas Donald Kidd

Mark Garrison Clark

Jason Thomas Stoll

An apparatus includes a printed circuit board (PCB) having a top surface, where the top surface includes a mounting aperture, a chassis, and a fastener having a width and length extending at least from the top surface of the PCB to the chassis through the mounting aperture. The apparatus also may include a logic ring that includes a via to a logic circuit of the PCB and a washer including a substantially flat surface including a high yield strength material. The washer may include a through-hole to accommodate the width of the fastener. The washer may additionally include a plurality of contact fingers extending out from the through-hole. The plurality of contact fingers is configured to contact the logic ring. The washer may be made to be in electrical communication with the chassis when compressed in response to a downward force from the fastener.

Logic-to-chassis printed circuit board (PCB) bolt and washer assembly

An EMI shield for an electronic system enclosure is disclosed. The EMI shield may include an electrically conductive panel with a plurality of air ventilation channels, which has an upstream airflow side and a downstream airflow side. The EMI shield may also include a first air ventilation channel with a first cross-sectional shape having a first cross-sectional area and a first depth. The EMI shield may further include a second air ventilation channel with a second cross-sectional shape, having a cross-sectional area greater than the first cross-sectional area, and a second depth larger than the first depth.

Variable thickness EMI shield with variable cooling channel size

An apparatus for electromagnetic compatibility (EMC) shielding, the apparatus comprising a first EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. A second EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. The first EMC shield coupled to the second EMC shield, wherein at least one finger element of the plurality of finger elements of the first EMC shield is situated between at least two finger elements of the plurality of finger elements of the second EMC shield and in parallel with the at least two finger elements such that a space is formed between the at least one finger element and at least one of the at least two finger elements.

Multiple-layered electromagnetic shielding

An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components.

Electromagnetic interference shield

A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

Growing community of inventors

Rochester, MN, United States of America

Timothy L McMillan