International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Technologies Netherlands B.v.

Airbnb, Inc.

Timothy Joseph Chainer

Pritish Ranjan Parida

Mark Delorman Schultz

Edward John Yarmchuk

Bucknell Chapman Webb

Madhusudan K Iyengar

Fanghao Yang

Roger R Schmidt

Vinod Kamath

Mark Edward Steinke

David P Graybill

Bejoy J Kochuparambil

Michael A Gaynes

Anthony Paul Praino

Joel Abraham Silberman

Milnes P David

Charles Philippe Tresser

Evan G Colgan

David William Abraham

Thomas J Brunschwiler

Chai Wah Wu

Claude Alexander Greengard

Wayne J Sohn

Hien Phu Dang

Gerard McVicker

Gerd Schlottig

Thomas K Worthington

Chin Lee Ong

Arvind Raj Mahankali Sridhar

Robert E Simons

Alper Buyuktosunoglu

Pradip Bose

Augusto Javier Vega

Robert A Scranton

Karl-Friedrich Etzold

Bulent Abali

Lubomyr Taras Romankiw

Nitendra Rajput

James Lee Hafner

Arun Sharma

Mohammad Banikazemi

Patrick Anthony Coico

Dan Edward Poff

Dennis G Manzer

Bernice E Rogowitz

Steven W Depp

Yasuo Amemiya

Leitao Chen

Daniel P Simco

Stephane Herman Maes

Gordon James Smith

Arvind Kumar

Paul Andrew Moskowitz

Alejandro Gabriel Schrott

Peter Alfred Gruber

John Peter Karidis

Jeffrey Donald Gelorme

Hal Hjalmar Ottesen

Todd Edward Takken

Robert J Von Gutfeld

Joshua M Rubin

Chandrasekhar Narayan

Emanuel Israel Cooper

Jonathan Darrel Coker

Layne A Berge

Ferdinand Hendriks

Philip Louis Trouilloud

Mantle Man-Hon Yu

Ephraim Feig

John Stewart Best

Monty Montague Denneau

David A Thompson

Tomasz J Nowicki

David Timothy Flynn

Marco Martens

Richard Greenberg

Christopher Lee Tessler

Kai R Schleupen

Marc A Taubenblatt

Suryanarayan G Hegde

Glen Nelson Biggs

Joseph D Rutledge

Krishnakumar Rao Surugucchi

Dana H Brown

John R Reidenbach

Jerry Lee Neubauer

Thomas W Glaser

Sol Krongelb

Howard Sachar

Robert E Schopp

Dean A Herman, Jr

William Robert Pulleyblank

Bruce P Kitchens

Steven C Gundersen

Ozgur Ozsun

Mark Dolorman Schultz

Avijit Mukherjee

Diego Anzola

Krishankumar Rao Surugucchi

An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.

Heterogeneous integrated multi-chip cooler module

A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.

Active control for two-phase cooling

A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.

Wafer scale supercomputer

A method for controlling a cooling system based on a heat dissipation of an electronic module and an ambient air temperature includes determining a combination of individual controls on components of the cooling system that achieve a specific amount of cooling based on a cooling power relationship for the plurality of components, the heat dissipation of the electronic module and the ambient air temperature, and applying the individual controls to the plurality of components.

Energy efficiency based control for a cooling system

A system for identifying and reporting traffic events is presented. Position and motion data from two or more vehicles are uploaded to a data center. The system identifies an accident between first and second vehicles by correlating the motion and position information of the first vehicle with the motion and position information of the second vehicle.

Traffic event recording and recreation

A data center cooling system is operated in a first mode, has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer fluid, and has an outdoor heat exchanger portion and a geothermal heat exchanger portion. The first mode includes ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and/or geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion. Based on an appropriate metric, a determination is made that a switch should be made from the first mode to a second, different, mode; and, responsive thereto, the data center cooling system is switched to the second mode. The second mode includes at least another of ambient air cooling of the heat transfer fluid in the outdoor heat exchanger portion and geothermal cooling of the heat transfer fluid in the geothermal heat exchanger portion.

Energy efficient data center liquid cooling with geothermal enhancement

Techniques for integrating two-phase cooling into a microprocessor chip package lid are provided. In one aspect, a vapor chamber lid device includes: an evaporator plate; a condenser plate attached to the evaporator plate such that a cavity is formed between the evaporator plate and the condenser plate; a thermal insulation layer sandwiched between the evaporator plate and the condenser plate; and a working fluid enclosed within the cavity, wherein the working fluid partially fills the cavity. At least one heat-dissipating device can be placed in thermal contact with the evaporator plate via a thermal interface material. A method is also provided for forming the vapor chamber lid device.

Module lid with embedded two-phase cooling and insulating layer

A method of detecting and identifying road surface defects is provided. Motion and position information is received from a plurality of vehicles. A profile is retrieved for a particular vehicle from a database of vehicle profiles by using an identifier of the particular vehicle. One or more criteria are identified for detecting a particular type of road surface defect based on the retrieved profile of the particular vehicle. Upon determining that the received motion and position data satisfies the identified criteria, a detection of a road surface defect of the particular type and a location associated with the detected road surface defect based on the received position information is reported.

Detection of road surface defects

An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

Thermal interface adhesion for transfer molded electronic components

A Personal Food Database (PFD) that resides on a consumer's mobile device is presented. The PFD maintains an inventory that keeps track of amount of available food items. The mobile device operating the PFD has sensors for measuring the activities or biometric data of the user. The PFD uses the sensor data to assess the nutrition need of the user and to recommend recipes accordingly.

Personal food database

Techniques that facilitate hybrid modeling for a device under test associated with a cooling system (e.g., a two-phase cooling system) are provided. In one example, information indicative of a first model of a device under test associated with a cooling system is determined. Second information indicative of constraints that define values for an operational quantity related to the cooling system is also determined. Information indicative of a second model for the device under test is generated based on the information indicative of the first model and the second information indicative of the one or more constraints. In an aspect, a first simulation process is performed to determine first thermal properties for a first simulation domain associated with the device under test. In another aspect, a second simulation process is performed to determine second thermal properties for a second simulation domain associated with the device under test.

Hybrid modeling for a device under test associated with a two-phase cooling system

Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

System level model for pumped two-phase cooling systems

Techniques for autonomously modeling a two-phase cooling architecture are provided. In one example, a computer-implemented method can comprise generating, by a system operatively coupled to a processor, a reduced physics model based on a profile of a heat source and a parameter of a cooling structure. The reduced physics model can provide an output. Also, the computer-implemented method can comprise generating, by the system, a full physics model based on the output. The computer-implemented method can further comprise combining, by the system, the reduced physics model and the full physics model to define an architecture that achieves a flow distribution of a coolant.

Autonomous development of two-phase cooling architecture

An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.

Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures

Growing community of inventors

Putnam Valley, NY, United States of America

Timothy Joseph Chainer