International Business Machines Corporation

Globalfoundries Inc.

Lenovo (singapore) Pte. Ltd.

Timothy Jerome Tofil

Joseph Paul Kuczynski

Matthew Stephen Doyle

Eric J Campbell

Kevin Albert Splittstoesser

Sarah K Czaplewski

Jeffrey N Judd

Mark David Plucinski

Sarah K Czaplewski-Campbell

Robert E Meyer, Iii

Kevin O'Connell

Chelsie M Peterson

Scott D Strand

Arvind Kumar Sinha

Paul Alan Vermilyea

Dylan J Boday

Cary Huettner

Gerald Keith Bartley

Patrick Kevin Egan

Jason T Wertz

Darryl John Becker

Gregory Ervin Balcome

Jing Zhang

Mark James Jeanson

Matthew Stephen Kelly

Henry Michael Newshutz

Brett Krull

Terry G Ryks

John Richard Dangler

Phillip V Mann

Matteo Cocchini

Samuel R Connor

Charles Luther Johnson

Michael D O'Connell

Thomas Donald Kidd

Stuart Brett Benefield

David R Motschman

Steven R Nickel

Mark Anthony Marnell

John E Kelly, Iii

King M A Chu

Andrew Corbett

An apparatus for tin whisker isolation and detection includes a substrate having a plurality of pads for connecting to an electronic component placed on the substrate, and a shield placed on a surface of the substrate. The shield includes a plurality of cavities aligned over the plurality of pads. A plurality of sensing components each associated with one of the plurality of cavities are configured for sensing an electrically conductive growth from a corresponding pad of the plurality of pads. A plurality of circuit connections are each configured to connect one of the sensing components to detection circuitry. The detection circuitry is configured to receive one or more sensing signals from one or more of the sensing components and detect an electrically conductive growth from the corresponding pad based on the one or more sensing signals.

Apparatus and method for tin whisker isolation and detection

According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.

Spectral autocorrelation based security system

Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.

Conductive particle interconnect switch

In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.

Composite materials including filled hollow glass filaments

An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.

Electrical apparatus having tin whisker sensing and prevention

A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.

Water-sensitive fluorophores for moisture content evaluation in hygroscopic polymers

Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.

Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.

Using ionic liquids in a programmable sensor

A multilayer component is coated with a fluorogenic probe designed to give off florescence when in contact with one or more metals in the multilayer component. The fluorogenic probe is exposed to radiation. The intensity and wavelength of the florescence is measured to determine a porosity of the one or more layers of the multilayer component.

Non-destructive method to determine porosity in metallic coatings

A device, method, and article of manufacture for corrosion monitoring are disclosed. The device includes a corrodible component and a silicone layer positioned over the corrodible component. The method includes providing a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component. The article of manufacture includes a corrosion monitoring assembly having a corrodible component and a silicone layer positioned over the corrodible component.

Silicone-modified corrosion monitor

A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.

Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper

A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.

Laminate materials with embedded heat-generating multi-compartment microcapsules

A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.

Self-heating thermal interface material

A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.

Secure crypto module including electrical shorting security layers

Growing community of inventors

Rochester, MN, United States of America

Timothy Jerome Tofil