Hewlett-Packard Development Company, L.p.

Timothy J Sutherland

Philip Wright

Markku Suomi

An interposer may include a plurality of magnetic plates disposed in the interposer. The interposer may further include contact pins disposed on an exterior portion of the interposer and alignment guides disposed on the exterior portion of the interposer. In an example, the contact pins may provide a serial bus connection.

Interposers with alignment guides

In some examples, a method of forming a logo on a device includes forming, using a laser, a pattern on an outer surface of a housing of the device, and soldering a metal to the pattern formed using the laser, the soldered metal forming the logo.

Logo on a device

In some examples, an apparatus includes a housing to removably attach to an electronic device that includes first and second cameras spaced apart by a first distance. The apparatus includes a first light transmissive region of the housing to align with the first camera, the first light transmissive region to pass light from an environment to the first camera. The apparatus further includes a second light transmissive region of the housing spaced apart from the first light transmissive region by a second distance different from the first distance, and a light conduit to pass the light from the environment through the second light transmissive region to the second camera.

Light transmissive regions to pass light to cameras

In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.

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San Diego, CA, United States of America

Timothy J Sutherland