Other

Robotic Vision Systems, Inc.

Timothy J Provencher

John W May

An apparatus for placing solder balls in a pattern on a substrate, e.g., to form a ball grid array, the apparatus comprising a template having a first plane, a second plane, and a plurality of holes passing substantially orthogonally through the first and second planes parallel to an axis and corresponding in location to the pattern. Each of the holes is slightly larger than a solder ball diameter. The apparatus also including a porous base having first and second planes, wherein the first plane of the base contacts the second plane of the template. The base is permeable to a fluid in a first direction from the first plane of the template toward the second plane of the base. The apparatus further includes a fluid controller in fluid communication with the base for selectively causing the fluid to pass through the holes and through the base in the first direction to force the solder balls into the holes. The base optionally but preferably comprises a carbon material, such as a carbon graphite material, and the fluid preferably comprises air.

Apparatus and method for filling a ball grid array

An apparatus for placing solder balls in a pattern on a substrate is provided for, for example, to create a ball grid array. The apparatus comprises a template having a first plane, a second plane, and a plurality of holes. The holes pass substantially orthogonally through the first and second planes so that the template is permeable to a fluid between the first and second planes. The holes correspond in location to the pattern and each of the holes passes through the template along an axis. Each of the holes has a first end adjacent to the first plane with a first cross section substantially parallel to the first plane. The first cross section has a first characteristic dimension, for example, a diameter if the first cross section is circular. In addition each of the holes has a second end adjacent to the second plane with a second cross section substantially parallel to the second plane. The second cross section has a second characteristic dimension. The second characteristic dimension is smaller than the first characteristic dimension and smaller than the solder ball diameter so solder balls will not pass through the template. Each hole further includes a wall extending substantially continuously from the first end to the second end. Related methods are also disclosed.

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Oro Valley, AZ, United States of America

Timothy J Provencher