Analog Devices,inc.

Oracle America, Inc.

Microcontinuum, Inc.

Colorado School of Mines Foundation, Inc.

Timothy J Frey

John R Martin

Christine H Tsau

Makoto Miyamoto

Michael W Judy

Faramarz Mahnad

W Dennis Slafer

John L Ritter

Satya Mallick

Joseph M Panish

Tzuo-Chang Lee

Paul Coles

Dennis Lauze

Michael Kearnan

Milford Kime

George Raniuk

Carl A Maietta

Matthew White

Peter V Meyers

Matthew B White

Chung-Heng Liu

A method of forming a MEMS device provides first and second wafers, where at least one of the first and second wafers has a two-dimensional array of MEMS devices. The method deposits a layer of first germanium onto the first wafer, and a layer of aluminum-germanium alloy onto the second wafer. To deposit the alloy, the method deposits a layer of aluminum onto the second wafer and then a layer of second germanium to the second wafer. Specifically, the layer of second germanium is deposited on the layer of aluminum. Next, the method brings the first wafer into contact with the second wafer so that the first germanium in the aluminum-germanium alloy contacts the second germanium. The wafers then are heated when the first and second germanium are in contact, and cooled to form a plurality of conductive hermetic seal rings about the plurality of the MEMS devices.

Apparatus and method of wafer bonding using compatible alloy

A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.

Substrate bonding with bonding material having rare earth metal

Method of substrate bonding with bonding material having rare Earth metal

A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.

Disclosed herein are aspects of optical tape technology, tape manufacturing, and tape usage. Methods and systems of tape technology disclose optical tape media including: configurations, formulations, markings, and structure; optical tape manufacturing methods, systems, and apparatus methods and systems including: curing processes, coating methods, embossing, drums, testing, tracking alignment stamper strip; optical tape methods and systems including: pick up head adapted for the disclosed optical tape; and optical tape uses including optical storage media devices for multimedia applications.

Optical tape drive systems

A pre-formatted optical data storage tape () including an elongated linear polymer layer having at least one pattern of optically readable embossments () on at least one surface of the polymer layer, and an optical recording layer covering the pattern of optically readable embossments () of the elongated linear polymer layer, wherein the optical recording layer is adapted such that recorded marks () may be made in the recording layer by directing a focused source of energy into the recording layer.

Pre-formatted linear optical data storage medium

Growing community of inventors

Hudson, MA, United States of America

Timothy J Frey