Other

Glo Ab

Nanosys, Inc.

Timothy Gallagher

Anusha Pokhriyal

Ambroise Prinstil

Fariba Danesh

Sharon N Farrens

Tsun Yin Lau

Anthony E J Strange

Taufik Taufik

Kenneth Louis Martz

Jeffrey Scott Gentile

Frank Patterson

Here presented is a series of Direct Connect Unifying Electrical Interface (UEI) based Cartridges (DC-Cartridges) or (DC-Outlets) created to deliver DC electricity originating from a DC-Homegrid System or any independent DC source. They offer a pathway for higher level DC delivery into a building. The DC-Cartridge series is constructed to unmistakably and easily be distinguished between other power delivery outlet formats used in other AC or DC arrangements. This series of cartridges is designed to offer higher DC power level output to a connected device as used in a home, commercial, and industrial applications. This would facilitate the integration of alternative energy supplies in the DC format for heavy load equipment, essential for the DC infrastructure of the future. The DC Cartridges can deliver power levels similar in fashion to the existing AC connectivity. Following in the standard set by the AC infrastructure, various DC levels are offered. A DC cartridge is offered to differentiate between each power level. Nomenclatures such as DCL, DCM and DCH are introduced to distinguish the various cartridge types and levels to set each apart from the other in the DC-Cartridge UEI based family.

Direct connect UEI cartridges for DC power systems

A system and method for a marine wrapper including a substrate, the substrate having an inner surface and an outer surface; and a coating fixedly adhered to the outer surface of the substrate, the coating including a bio-enhancing material to encourage marine growth on the outer surface of the substrate.

Wrapper apparatus encouraging growth of marine life

A transfer method includes providing a first light emitting diode on a first substrate, performing a partial laser liftoff of the first light emitting diode from the first substrate, laser bonding the first light emitting diode to the backplane after performing the partial laser liftoff, and separating the first substrate from the first light emitting diode after the laser bonding.

Partial laser liftoff process during die transfer and structures formed by the same

A Direct Connect Homegrid (DC-Homegrid) system for Direct Current (DC) power control and delivery into a structure by way of Unifying Electrical Interface (UEI) platforms is here presented. By means of the Homegrid, multiple self-contained approaches are introduced to keep a structure powered with DC, either as a substitute or as a supplement to the conventional Alternating Current (AC) source. By the illustrated approaches contained herein, a new methodology permitting to retain power operation in the occurrence of a blackout, due to natural disaster, cyber-attack or any other conventional AC grid failure, is revealed. Such DC-Homegrid is envisioned to become the precursor in establishing the DC infrastructure of the future. The embodiments presented in this patent illustrate alternate methods for achieving power independence while increasing the value for adoption of renewable and sustainable energy.

Direct connect Homegrid system for DC power distribution

Selective transfer of dies including semiconductor devices to a target substrate can be performed employing local laser irradiation. Coining of at least one set of solder material portions can be employed to provide a planar surface-to-surface contact and to facilitate bonding of adjoining pairs of bond structures. Laser irradiation on the solder material portions can be employed to sequentially bond selected pairs of mated bonding structures, while preventing bonding of devices not to be transferred to the target substrate. Additional laser irradiation can be employed to selectively detach bonded devices, while not detaching devices that are not bonded to the target substrate. The transferred devices can be pressed against the target substrate during a second reflow process so that the top surfaces of the transferred devices can be coplanar. Wetting layers of different sizes can be employed to provide a trapezoidal vertical cross-sectional profile for reflowed solder material portions.

Method of selectively transferring LED die to a backplane using height controlled bonding structures

A backplane can have a non-planar top surface. Insulating material portions including planar top surface regions located within a same horizontal plane are formed over the backplane. A two-dimensional array of metal plate clusters is formed over the insulating material portions. Each of the metal plate clusters includes a plurality of metal plates. Each metal plate includes a horizontal metal plate portion overlying a planar top surface region and a connection metal portion connected to a respective metal interconnect structure in the backplane. A two-dimensional array of light emitting device clusters is bonded to the backplane through respective bonding structures. Each light emitting device cluster includes a plurality of light emitting devices overlying a respective metal plate cluster.

LED backplane having planar bonding surfaces and method of making thereof

The disclosed Unifying Electrical Interface presents a versatile connectivity platform having the merging capabilities permitting more than a singular voltage, level or type to be made available from an electrical outlet. When wired fully, the choice of AC and/or DC made available to the consumer is broadened. Direct Current (DC) provided via the UEI would originate from a locally based DC source access point obviating the need to use wall chargers or power supplies that wastefully consume energy even when in standby mode. By this approach, the UEI based system extends an avenue for renewable energy technology to be made readily available in a building; while offering a synergistic advantage for the end user, the energy provider and the environment by reducing energy waste. That power conservation and accessibility will result in greater choice and savings for the consumer and will reduce the need for excess production from electric providers.

Unifying electrical interface connection platform

A method of repairing a light emitting device assembly includes providing a light emitting device assembly including a backplane and light emitting devices, where a predominant subset of pixels in the light emitting device assembly includes an empty site for accommodating a repair light emitting device, generating a test map that identifies non-functional light emitting devices in the light emitting device assembly, providing an assembly of a repair head and repair light emitting devices, wherein the repair light emitting devices are located only on locations that are mirror images of empty sites within defective pixels that include non-functional light emitting devices, and transferring the repair light emitting devices from the repair head to the backplane in the empty site in the defective pixels.

Selective die repair on a light emitting device assembly

This sit-up support device is designed to hold a person's feet when they are performing bent knee sit-ups. Primarily, it consists of a base plate that is rendered stationary to the floor by a clamp that fastens to a door. The device also includes quick-release straps on the base plate, for comfortably holding the user's feet, and a threaded shaft and sleeve are provided in conjunction with the clamp, to force the base plate hard down to the floor.

Growing community of inventors

Pleasanton, CA, United States of America

Timothy Gallagher