International Business Machines Corporation

Timothy G Dunham

William C Leipold

Howard Smith Landis

Mark Alan Lavin

Ezra D B Hall

Valarmathi C Shanmugam

Daniel Nelson Maynard

Michael E Scaman

David L DeMaris

Shi Zhong

Joseph B Allen

Robert K Leidy

William Thomas Motsiff

Richard John Rassel

Kevin N Ogg

Maharaj Mukherjee

James A Culp

Gary S Ditlow

Daria Rose Dooling

Ralph James Williams

Stephen D Thomas

Paul C Buschner

A system and method for generating test patterns for a pattern sensitive algorithm. The method comprises the steps extracting feature samples from a layout design; grouping feature samples into clusters; selecting at least one area from the layout design that covers a feature sample from each cluster; and saving each pattern layout covered by the at least one area as test patterns.

System and method for testing pattern sensitive algorithms for semiconductor design

A method for reducing a number of shapes, and a computer readable program code adapted to perform said method. The method forms first and second shape patterns. The second shape pattern includes the first shape pattern and error shapes. The error shapes are extracted from the second shape pattern. At least one environment shape corresponding to each error shape is derived from a subset of the error shapes. For example, each error shape in the subset may be expanded to form a corresponding expanded shape, and at least one environment shape corresponding to each expanded shape may be formed by removing all portions of the expanded shape common to the second shape pattern. The environment shape reflects a local geometric environment of its corresponding error shape. A subset of the environment shapes are deleted such that only unique environment shapes satisfying a selection criterion remain.

Removal of relatively unimportant shapes from a set of shapes

An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.

Shapes-based migration of aluminum designs to copper damascene

Stitched integrated circuit (IC) chip layout design structures are disclosed. In one embodiment, a design structure embodied in a machine readable medium used in a design process includes: an integrated circuit (IC) chip layout exceeding a size of a photolithography tool field, the IC chip layout including: a plurality of stitched regions including at least one redundant stitched region or at least one unique stitched region; and for each stitched region: a boundary identification identifying a boundary of the stitched region at which stitching occurs.

Stitched IC chip layout design structure

Stitched integrated circuit (IC) chip layout methods, systems and program products are disclosed. In one embodiment, a method includes obtaining from a first entity a circuit design for an IC chip layout that exceeds a size of a photolithography tool field at a second entity, wherein the IC chip layout includes for at least one stitched region of a plurality of stitched regions: a boundary identification identifying a boundary of the at least one stitched region at which stitching occurs and a type indicator indicating whether the at least one stitched region is one of: redundant and unique; dissecting the IC chip layout into stitched regions indicated as unique or redundant at the second entity; and generating a photolithographic reticle at the second entity based on the plurality of stitched regions, the photolithographic reticle having a size that fits within the size of the photolithographic tool field at the second entity.

Stitched IC layout methods, systems and program product

A computer program product for generating test patterns for a pattern sensitive algorithm. The program product includes code for extracting feature samples from a layout design; grouping feature samples into clusters; selecting at least one area from the layout design that covers a feature sample from each cluster; and saving each pattern layout covered by the at least one area as test patterns.

Testing pattern sensitive algorithms for semiconductor design

A method of designing a layout for manufacturing an integrated circuit is provided, in which computationally intensive portions of the design process, such as simulation of an image transferred through a mask design, or simulation of electrical characteristics of a circuit, are performed more efficiently by only performing such computations on single instance of computational subunits that have an identical geometrical context. Thus, rather than performing such computations based on the functional layout, for which typical design process steps result in significant flattening of the functional hierarchy, and therefore increase the cost of computation, the invention performs simulations on computational subunits stored in a hierarchy based on geometrical context, which minimizes the cost of simulation. The resulting simulation results are subsequently assembled according to the functional layout.

Methodology to improve turnaround for integrated circuit design using geometrical hierarchy

Reducing number of relatively unimportant shapes from a set of shapes

Disclosed is a method and structure that partitions an integrated circuit design by identifying logical blocks within the integrated circuit design based on size heuristics of logical macros in the design hierarchy. The invention determines whether the number of logical blocks is within a range of desired number of logical blocks and repeats the process of identifying logical blocks for different hierarchical levels of the integrated circuit design until the number of logical blocks is within the range of the desired number of logical blocks. This serves as a guide to partition the chip as opposed to a grid-like partitioning.

Autonomic graphical partitioning

An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.

Shapes-based migration of aluminum designs to copper damascence

Disclosed is a semiconductor device comprising: a multiplicity of wiring levels, each wiring level comprising conductive wires and a multiplicity of conductive fill shapes embedded in a dielectric; at least some of the fill shapes in at least two adjacent wiring levels being co-aligned; and where the fill shapes on adjacent levels are aligned, one or more conductive vias extending between and joining each co-aligned fill shape in each adjacent wiring level. The joined fill shapes serve to reinforce and support the dielectric, which may be a non-rigid or low-k dielectric.

Growing community of inventors

South Burlington, VT, United States of America

Timothy G Dunham