Honeywell G.m.b.h.

Bae Systems Information and Electronic Systems Integration Inc.

Lockheed Martin Corporation

Radeum, Inc.

Lockheed Martin Ir Imaging Systems, Inc.

Aura Communications, Inc.

Aura Communications Technology, Inc.

Asis Gmbh

Timothy E White

Kenneth R Erikson

Neal R Butler

Charles McAlister Marshall

Vincent Palermo

David L Jungkman

Anthony M Nicoli

R Calvin Owen, Jr

Curtis A Vock

Andrew Ziegler

Andrew Jones

Michael A Martinelli

Wayne C Haase

George K Lewis

James W Howard

Jeffrey R LaFranchise

Marcus Hatch

John W Marciniec

Michael R Dynok

Stephen A Voegelin

An apparatus for portable communications including a wireless headset, attachment that mechanically and electrically connects to a cellular phone or other electronic device, and a base unit that includes an attachment interface to connect mechanically and electrically with the attachment to allow the base unit to receive electrical signals from the cellular phone. The base unit wirelessly transmits a representation of an electrical signals received from the cellular phone to the wireless headset. The apparatus may also include a clip to attach the integrated base unit to an article of clothing, such as a belt, worn by a person.

Transceiver device and fastener

Contents of one or more received messages can be analyzed to determine whether a transceiver device generating the inductive field has already been programmed with a unique communication code. If not, bidirectional communications can be established to program the transceiver device with a unique communication code over an inductive link. Orientation or position of a transceiver device can be used to initiate a process for programming a communication code. Generally, the communication code can define a unique relationship between two or more transceiver devices.

Techniques for inductive communication systems

An ear mounted speaker assembly provides improved internal and external stability of a &ldquo;in-the-ear&rdquo; headset. A housing containing a speaker further contains an extender, audio portion and electrical compartment. The extender is adapted to rest in the intertragic notch of the ear. The audio portion is mounted to the extender and is of greater width than the extender. The audio portion is adapted to be positioned within the lower concha behind the tragus and antitragus of the ear. The compressible retainer extends from the surface of the housing and presses against the upper concha of the ear. The strut extends from the lower surface of the housing below the extender and extends downward outside the intertragic notch and presses against skin to stabilize the speaker assembly within the ear. Compressible retainers may be interchangeable and may come in a kit containing a plurality of interchangeable compressible retainers of a variety of shapes.

In-the-ear headset

An integrated piezoelectric ultrasound array structure configured to minimize the effects of differential thermal expansion between the array and the integrated circuit and to improve the mechanical and acoustical integrity of the array. The transducer array may have an interposed thinned supporting substrate and is matched to the integrated circuit substrate for thermal expansion so as to retain mechanical integrity of the array/IC bond within the working temperature range. Transducer elements are laterally isolated acoustically and as to thermal expansion by air or other acoustically attenuating medium of lower elastic modulus material between the elements. Acoustical effects are vertically acoustically isolated with capacitive coupling and small area solder bumps relative to wavelength, and further laterally acoustically isolated by thin supporting substrates relative to wavelength, including thinned semiconductor integrated circuit substrates.

Piezocomposite ultrasound array and integrated circuit assembly with improved thermal expansion and acoustical crosstalk characteristics

A high density, exceptionally complex and compact ultrasound transducer array using multi-layer structures composed of active integrated circuit devices on various substrates and passive devices. Electrically conducting interconnections between substrates are implemented with micro-vias configured with conductors extending through the substrates, permitting the use of divided or different integrated circuit technologies arranged and/or isolated within different integrated circuit substrates or layers of the ultrasound transducer assembly. The various layers may be assembled with solders of respectively lower reflow temperatures, to permit testing of selected layers and circuits prior to completion.

Acoustical array with multilayer substrate integrated circuits

An ultrasonic camera having a high efficiency ultrasonic lens is coupled to a ultrasonic transmitter/receiver by a stretched membrane interface. The ultrasonic lens provides highly efficient transmission of ultrasound without introducing aberrations. The ultrasound system also uses a quasi incoherent source to reduce speckle noise in the image.

DIV: ultrasonic camera

Ultrasonic camera

An array of ultrasonic transducers, where each of the ultrasonic transducers has a matching layer end and a driving layer/individually isolated end. A bump bond connects each one of the ultrasonic transducers to a substrate. A high voltage electrical conductor is connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the ultrasonic transducers. A conductive/matching layer is disposed to electrically connect each matching layer end. An outer matching layer is connected to the conductive/matching layer. The bump bond is an indium or solder bump bond having a contact area for contact with an ultrasonic transducer less than 20 percent of the driving layer/individually isolated end for the contacted ultrasonic transducer so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.

Ultrasonic array with attenuating electrical interconnects

Apparatus in a thermal radiation detection device including optics having a focal plane comprising a cold mounting surface, a detector array, a standoff and apparatus for protecting the detectors from intense thermal radiation. The detector array includes a plurality of radiation sensitive detectors mounted on a carrier in thermal contact with the cold mounting surface. The standoff defines a cold platform proximate to the detector array and mounted to the cold mounting surface. A substrate includes a film of vanadium trioxide on a first surface, wherein the substrate is mounted to the standoff at the first surface and wherein the substrate is structured and arranged to interpose the vanadium trioxide film between the detector array and a radiation source and is located proximate the focal plane. The vanadium trioxide film has a transition temperature above which it becomes reflective of the source radiation and the cold platform is maintained at a temperature below the transition temperature in the absence of intense external radiation impinging on the film.

V.sub.2 O.sub.3 protection for IR detector arrays against intense

A prism cold shield adaptable to an infrared detector system comprising a prism-shaped substrate having an upper portion partially coated with opaque material and a lower portion partially coated with opaque material wherein windows formed by the upper and lower coatings defined the field of view for a plurality of infrared detectors thereby cold shielding the detectors in the linear direction of the detector array.

Prism cold shield

Growing community of inventors

Acton, MA, United States of America

Timothy E White