Intel Corporation

Timothy E McIntosh

Sasha N Oster

John Stephen Guzek

Debendra Mallik

Johanna M Swan

Adel A Elsherbini

Shawna M Liff

Feras Eid

Telesphor Kamgaing

Robert L Sankman

Kemal Aygun

Omkar G Karhade

James Chris Matayabas, Jr

Ravi V Mahajan

Charles A Gealer

Embodiment of the present disclosure describe integrated circuit package assemblies that allow for relatively short connections between devices such as a processor and memory. In one embodiment, a package assembly includes a die embedded in a subpackage directly coupled to another die attached to the subpackage. In some embodiments the subpackage may also contain power management devices. In some embodiments the die embedded in the subpackage and/or the power management device may overlap, or be located in, a region defined by the die coupled to the subpackage such that they are located between the die coupled to the subpackage and a substrate underlying the subpackage. Other embodiments may be described and/or claimed.

Embedded memory and power management subpackage

This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

Flexible electronic assembly method

Growing community of inventors

Phoenix, AZ, United States of America

Timothy E McIntosh