Raytheon Company

Timothy D Keesey

Clifton Quan

Gerald A Cox

David E Roberts

Raymond C Tugwell

Chris E Schutzenberger

Douglas A Hubbard

David T Winslow

John A Crockett, Jr

Kenneth M Webb

James P Treinen

Stephen R Kerner

Colleen Tallman

An array antenna with an embedded subaperture includes an array of radiator elements. The array includes a subaperture of one or a group of the radiator elements. A main receive channel is coupled to at least some of the radiator elements by a feed network. An RF power dividing network is connected in a signal path between the subaperture and the special use receive channel, and is adapted to allow at least most of the RF energy from the subaperture to pass to the special use receiver channel while diverting a small amount of energy to the main receive channel. The array includes circuitry for introducing an amplitude taper to signals received from the array of radiator elements, so that some of the signals from the radiator elements are attenuated to achieve the amplitude taper. The circuitry in an exemplary embodiment includes the RF power dividing network, wherein the small amount of energy diverted to the main receive channel from the subaperture is substantially equal to an attenuated signal level for the subaperture to achieve an amplitude taper attenuation.

Array antenna with embedded subapertures

A connector providing an offset interconnect has a dielectric body with first and second longitudinally opposed and laterally offset portions and an internal cavity. An offset electrically conductive path is disposed within the internal cavity. The offset electrically conductive path extends from the first portion of the dielectric body to the second portion of the dielectric body. A compressible conductor is disposed within the internal cavity in the second portion of the dielectric body.

Offset connector with compressible conductor

An RF interconnect between an airline circuit including a dielectric substrate having a conductor trace formed on a first substrate surface and an RF circuit separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the substrate and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the airline circuit.

Vertical interconnect between coaxial or GCPW circuits and airline via compressible center conductors

An RF interconnect between a rectangular coaxial transmission line including a coaxial center conductor and a dielectric structure with a rectilinear cross-sectional configuration fitted around the coaxial center conductor and an RF circuit separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the rectangular coaxial transmission line and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the center conductor of the rectangular coaxial transmission line.

Vertical interconnect between coaxial and rectangular coaxial transmission line via compressible center conductors

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Garden Grove, CA, United States of America

Timothy D Keesey