Karl Suss America, Inc.

Timothy Consentino

Gregory George

Seth A Wright

James Ziegler

Tim Peery

Michael Kuhnle

The object of the invention is to provide an automatic module and cassette station detecting and aligning semiconductor wafer/substrate material handling unit with a thermal processing chamber module having an integrated, sturdy, chemical and temperature resistant wafer lift pins and door actuation apparatus. One of the benefits that is derived from this apparatus is the ability to quickly and easily attach various processing modules at any docking position of the semiconductor wafer/substrate material handling unit (hereinafter MHU). The MHU of this apparatus has the additional benefit of a cassette station that automatically aligns and detects a plurality of different size and shape semiconductor wafer/substrate cassettes. The semiconductor wafer/substrate cassettes may also be functionally attached to a module that is docked to the MHU for use. A further benefit of this apparatus is the ability to cluster MHUs providing for the use of additional modules, all of which may be controlled by one central processing unit. Additionally the modules and MHU are specifically designed to dock and lock utilizing a locating mechanism which places the module in the precise location with respect to the MHU for use. Once the module is docked and then locked the exhaust interface between the module and the MHU self-aligns and self-seals. In a Thermal Processing Chamber module utilizing the benefits of the aforementioned modularity, docking and locking, clustering, and exhaust interfacing, this invention further enure the benefit of an integrated compact wafer lift pin and door actuation mechanism which provides for a low-profile lift pin mechanism that maintains the lift pins at a level position during operation and an integrated chamber door utilizing one prime mover and one control path which simplifies operation and reduces parts count and improves the reliability of the module's precise acceptance and delivery of a wafer from the MHU. In yet another benefit of this disclosure in the Thermal Processing Chamber module this invention utilizes thermal processing chamber lift pins comprised of materials of very low thermal conductivity which are sturdy, chemical and temperature resistant and hence minimize the pins thermal effect on the resist coating thickness applied to a wafer.

Growing community of inventors

Waitsfield, VT, United States of America

Timothy Consentino