Apple Inc.

Lockheed Martin Corporation

Timothy Bryan Ogilvie

Daniel J Hiemstra

Eric Steven Jol

Timothy Michael Johnson

Ibuki Kamei

Jason S Sloey

Daniel C Wagman

Jorge L Rivera Espinoza

Jayesh Nath

Bo Zhang

Berke Cetinoneri

Xiaofang Mu

Chi V Pham

Mingjuan Zhu

Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.

Distributed-element filter for mmWave frequencies

A first device such as a wristwatch may include a front face at which a display is disposed and a rear face at which a rear housing wall is mounted. Antenna structures may overlap the rear housing wall and may be operable to transmit and receive relatively high frequency signals through the rear housing wall to a communication with a second device such as a wireless power transmitting device for the wristwatch. The second device may also include antenna structures that overlap a top surface housing. Respective sets of magnetic structures may be provided in the first and second devices to align the two devices and to form a reliable wireless communication link between the two devices. The first and second devices may include respective antenna arrays that include pairs of antenna elements that are selectively used to form a reliable wireless communication link.

Systems and methods for establishing reliable wireless links

High-speed connectors that save space in an electronic device, are simple to connect, and are readily manufactured. One example can provide a high-speed connector having high-speed connections. The high-speed connections can be integrated with low-speed connections in a board-to-board structure to save space in an electronic device. An example can provide high-speed connections that are simple to connect. The board-to-board structure can include a board-to-board plug, where each high-speed connection includes a high-speed contact having a lateral portion. The lateral portion can include right-angle tabs to guide a central conductor of a coaxial cable. The central conductor of each coaxial cable can be soldered to a corresponding lateral portion. Ground contacts for the board-to-board plug can include crimping portions to connect to an outer shield of each coaxial cable. These high-speed connectors can be readily manufactured by utilizing stamped contacts and molded housings.

Integrated high frequency connector

A first device such as a wristwatch may include a front face at which a display is disposed and a rear face at which a rear housing wall is mounted. Antenna structures may overlap the rear housing wall and may be operable to transit and receive relatively high frequency signals through the rear housing wall to a communication with a second device such as a wireless power transmitting device for the wristwatch. The second device may also include antenna structures that overlap a top surface housing. Respective sets of magnetic structures may be provided in the first and second devices to align the two devices and to form a reliable wireless communication link between the two devices. The first and second devices may include respective antenna arrays that include pairs of antenna elements that are selectively used to form a reliable wireless communication link.

An electronic device may include a display formed at a front face and a backside circuitry module formed at a rear face that opposes the front face. The backside circuitry module may be surrounded by coil structures and may be aligned with a protrusion in a rear wall housing at the rear face. The backside circuitry module may include a substrate to which sensor components or other components may be mounted. In particular, sensor circuitry, sensors, transceiver circuitry, connector circuitry, etc. may be mounted to the substrate. Antenna structures may be embedded within the substrate along with conductive paths for the sensor components and other components mounted to the substrate. Support structures in the backside circuitry module may support the substrate, sensor components, and other components. If desired, antenna structures may be formed on the support structures.

Electronic devices having integrated antenna structures

An antenna cell for a wide-scan low-profile phased array system includes an antenna layer including one or more stacked conductive radiators configured to receive electromagnetic waves. The antenna cell also includes a feed layer that includes multiple rectangular slots and one or more feed structures. Each rectangular slot may excite an orthogonal polarization. The feed structures are positioned perpendicular to one another, and each of the feed structures includes a feed fork that includes a set of open-circuit stubs and is configured to tune antenna performance.

Growing community of inventors

San Jose, CA, United States of America

Timothy Bryan Ogilvie