National Technology & Engineering Solutions of Sandia, LLC

Timothy Briggs

Brian T Werner

Joseph Carlson

Bryan Loyola

Stacy Michelle Nelson

Kyle James LeBlanc

Ryan B Sills

Brian K Holliday

An apparatus and method for preparing Double Cantilever Beam (DCB) specimens are disclosed as an apparatus and method for conducting Mode I fracture resistance testing using the DCB specimens. In a first embodiment, a drill jig is used to locate the DCB specimen and guide a drilling process during creation of at least one through-hole in the DCB specimen. The drilling process may employ a traditional drill and drill bit, a laser drill, or a water jet. In another embodiment, a set of rotating pin blocks, each with a full-round or a half-round specimen pin at one end and a hanger full-round pin at the other end, engage the DCB specimen and facilitate the internal application of a fracturing load to the DCB specimen for the Mode I fracture resistance test. The present invention may significantly reduce the time and materials needed to prepare and test a DCB specimen.

Mode I fracture testing fixture

A rivet assembly for securing a wire in electrical communication with a substrate having a hollow cylindrical body with a first opening at a proximal end and a second opening at a distal end. The rivet assembly further includes a wire with a portion in electrical communication with the cylindrical body. The rivet assembly yet further includes a compression mechanism configured for use selectively compressing the cylindrical body along an axial direction. Compression of the cylindrical body can cause diametric expansion of an outer diameter of the cylindrical body to retain the cylindrical body within a substrate. The rivet assembly additionally includes wire retention structure configured for holding the wire in electrical contact with the compressed cylindrical body.

Wire rivet

A laminate comprising a first ply, a second ply, and a third ply which sandwiching the second ply between the first ply and the third ply. The laminate further includes a first plurality of interfacial modifiers arranged between opposing faces of the first ply and the second ply. The first plurality of interfacial modifiers are arranged in a first pattern. The laminate includes a second plurality of interfacial modifiers arranged between opposing faces of the second ply and the third ply such that the first plurality of interfacial modifiers and the second plurality of interfacial modifiers are arranged on opposite faces of the second ply. The second plurality of interfacial modifiers are arranged in a second pattern. The first pattern and the second pattern are configured to increase crack growth resistance of the laminate by selectively toughening portions of the laminate to control propagation of interfacial cracks within the laminate.

Enhanced composites via selective interfacial modification

A laminate comprising a first ply, a second ply, and a plurality of interfacial modifiers arranged between opposing faces of the first ply and the second ply. A chemical composition of an interfacial modifier of the plurality of interfacial modifiers can be selected based on a resulting bond strength between the interfacial modifier of the plurality of interfacial modifiers and at least one of the first ply or the second ply. The plurality of interfacial modifiers can be arranged in a pattern to selectively modify toughness of a portion of the laminate based on the bond strength of the interfacial modifier of the plurality of interfacial modifiers.

Selective modifiers for composite material property enhancement

Various technologies to facilitate coupled electrical and mechanical measurement of conductive materials are disclosed herein. A gripping device simultaneously holds a specimen in place and causes contact to be made between the specimen and a plurality of electrodes connected to an electrical measuring device. An electrical characteristic of the specimen is then measured while a mechanical load is applied to the specimen, and a relationship between the mechanical load and changes in the electrical characteristic can be identified.

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Brentwood, CA, United States of America

Timothy Briggs