Optical Communication Products, Inc.

Signify Holding B.v.

Eaton Intelligent Power Limited

Optical Communications Products, Inc.

Timothy Bingaman

Carl W Embry

Mark Stiehl

Michael Tartaglia

Gregory Parker, Ii

Michael Dudek

Dale Isaacson

Ashley Pickens

Steven Anderson

Raymond George Janik

Alexander James Ross

John Leon

John Strom

William E Getzinger

Mark Eginton

Jason Medric Eubanks

Kevin Strickfaden

Stephen Geyer

Craig Mynatt

Allen Tracy

A luminaire comprising: a chassis (), the chassis () comprising: four walls joined to form a rectangular cavity, each wall of the four walls comprising: &#x2014;a heat sink (); &#x2014;a wiring channel (); &#x2014;a first receiving channel () on a first side of the heat sink (); and&#x2014;a second receiving channel () on a second side of the heat sink (); a light emitting diode board () attached to a first wall of the four walls; a first extrusion () attached to a second wall of the four walls; a second extrusion () attached to a third wall of the four walls; wherein the light emitting diode board () comprises a first protrusion that fits into the first receiving channel and a second protrusion that fits into the second receiving channel; and wherein the light emitting diode board () rests on the heat sink () of the first wall when the first protrusion is fit into the first receiving channel and the second protrusion is fit into the second receiving channel.

Linear modular luminaire

An electrical circuit can include a circuit board having a first portion and a second portion. The electrical circuit can also include at least one first light source disposed on the first portion. The electrical circuit can further include multiple second light sources disposed on a trimmable section of the second portion. The electrical circuit can also include at least one third light source disposed on a non-trimmable section of the second portion. The trimmable section can be trimmed to form a trimmed circuit board. The trimmed circuit board can have disposed thereon a remainder of the plurality of the second light sources. The at least one first light source, the remainder of the plurality of second light sources, and the at least one third light source can be disposed on the trimmed circuit board in such a way as to provide substantially uniform light.

Scalable self-regulating circuits comprising trimmable and non-trimmable sections

A luminaire can include a power source housing that houses at least one light fixture component. The luminaire can also include a light engine tray disposed proximate to the power source housing. The luminaire further can include a first acoustic feature coupled to the power source housing and the light engine tray, where the first acoustic feature comprises a first side wall having a first configuration, where the first configuration of the first side wall absorbs sound.

Acoustic luminaires

A linear light fixture can include a housing that includes at least one wall that forms a cavity. The linear light fixture can also a light board having multiple light sources disposed thereon, where the light sources are arranged in a linear fashion with respect to each other on the light board, where the light board is disposed within the cavity of the housing. The linear light fixture can further include a lens slidably disposed within a receiving feature of the housing. The linear light fixture can also include a first auxiliary optical member disposed within cavity of the housing, where the first auxiliary optical member includes a first body having a first end and a second end, where the first body includes a light diffusion film. The first auxiliary optical member can fill a first gap between the lens and a first side wall of the housing.

Light leak solutions for linear light fixtures

In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Optical interface unit

A method and apparatus for coupling light from an array of optoelectronic devices to a corresponding array of fibers contained in a fiber optic ferrule is disclosed. The fibers may be single-mode or multi-mode optical fibers. The method includes fixing the fiber optic ferrule to the optical subassembly (OSA) base upon which the array of optoelectronic devices will be affixed, aligning the array of optoelectronic devices to the corresponding array of fibers, then securing the array of optoelectronic devices to the OSA base. In one embodiment, the module includes an optical subassembly module housing a linear array of 1300 nm VCSELs or photodetectors, spaced apart at a 250 micron pitch to correspond to the spacing of optical fibers in a conventional MT ferrule. The array of optoelectronic devices is mounted on a substrate assembly that includes a weldable surface and one or more photodetectors for automatic power control. After the components are aligned, the substrate assembly is affixed to the OSA base by epoxying or welding. The material within the substrate assembly is transparent to the emitted light or includes a notch or hole that allows light to pass through, in order to facilitate the integral placement of the monitor within the substrate assembly and beneath the material.

VCSEL array optical subassembly module with alignment mechanism

A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and &thgr; directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die.

Plastic encapsulation of optoelectronic devices for optical coupling

Growing community of inventors

Thornton, CO, United States of America

Timothy Bingaman