Sony Group Corporation

Sony Semiconductor Solutions Corporation

Timothy Beard

Bernadette Elliott-bowman

Christopher James Wright

Matthew Lawrenson

Hirohito Miyazaki

Kosuke Hareyama

Jo Umezawa

Yuji Nishida

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

Substrate and semiconductor package

An object of the present technology is to prevent damage in a bonded portion between a semiconductor chip and a substrate in a semiconductor device in which the semiconductor chip is mounted on the substrate. A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element and the electrode of the substrate. The terminal includes a plurality of unit lattices and a coupling portion. The unit lattices included in the terminal are formed by bonding a plurality of beams in a cube shape. The coupling portion included in the terminal couples adjacent unit lattices among the plurality of unit lattices.

Terminal and connection method

Provided is a thermoelectric power generation module that includes a heat-dissipating body that dissipates heat generated by a heat-generating body, a thermoelectric power generation element disposed at an approximately central section of a top surface of the heat-dissipating body, and a thermally-responsive body that is disposed on an outer peripheral section of the top surface of the heat-dissipating body and whose thermal resistance changes according to temperature. The thermoelectric power generation element and the thermally-responsive body are disposed on a bottom surface of the heat-generating body, and the thermally-responsive body is formed such that the thermal resistance of the thermally-responsive body becomes larger than that for the thermoelectric power generation element when the heat-generating body has a low temperature and that the thermal resistance of the thermally-responsive body becomes equal to or smaller than that for the thermoelectric power generation element when the heat-generating body has a high temperature.

Thermoelectric power generation module and method of manufacturing thermoelectric power generation module

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London, United Kingdom

Timothy Beard