Delphi Technologies, Inc.

Timothy A Vas

Stephen P Long

Timothy M Betzner

Dan W Chilcott

Hamid Reza Borzabadi

John Carl Christenson

William J Baney

Philip D Kuznia

John Emmett Freeman

George M Queen

David Kay Lambert

Gregory J Manlove

Kevin J Hawes

Abhijeet V Chavan

Dennis Michael Koglin

Han-Sheng Lee

Derek A Delrymple

James H Logsdon

Michael Joseph McHale

Lewis Henry Little

Ronald D Wilcox

Ricardo R Dorado

David G Miller

Raul I Quiroz

Gary A Hiner

Jeffrey L McGrew

A fuel system for an internal combustion engine includes an electric fuel pump; a conduit which defines a flow path through which fuel flows from the electric fuel pump to the internal combustion engine; a fuel pump control module with electronics which drive the electric fuel pump, the fuel pump control module being disposed within a compartment defined by a wall; and a heat sink in thermal contact with the fuel pump control module and extending out of the compartment through an aperture of the wall and into the flow path such that the heat sink is sealed to the wall, thereby preventing fluid communication through the aperture.

Fuel system with a fuel pump control module and a heat sink

An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.

Sealed engine control module with integral ambient air pressure sensor

A dual pressure sensor apparatus configured for attachment to a manifold includes a molded plastic housing with a body portion featuring an upper cavity, a measurement port, and a lower cavity closed by the manifold. First and second pressure sensor modules are mounted in first and second wells formed in the upper cavity, and electrically coupled to a set of leadframe terminals disposed in the upper cavity. An opening in the first well couples the first pressure sensor module to the measurement port, and an opening in the second well couples the second pressure sensor module to the lower cavity. The measurement port sealingly extends through an opening in the manifold so that the first pressure sensor module measures pressure in the manifold, and the body portion walls bounding the lower cavity are notched so that the second pressure sensor module measures atmospheric or barometric pressure outside the manifold.

Dual pressure sensor apparatus

Silicon-based high pressure sensor modules are manufactured in an array arrangement, incorporating a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. Bossed containers filled with oil are mounted on the substrate in an array. These bossed containers house the sensor cells which are composed of a sensor handle wafer and a diaphragm. The top surface of these bossed containers are flexible and deflect under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensors can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

Method of making pressure sensor assemblies

A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Sensor module

A silicon-based high pressure sensor module incorporates a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. A bossed container filled with oil is mounted on the substrate and houses a sensor cell. The top surface of the bossed container is flexible and deflects under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensor can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

Pressure sensor assembly

A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.

Process of forming a capacitative audio transducer

A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors. The sensor-compensation circuit pairs are calibrated and singulated for final packaging.

Integrated pressure sensor and method of manufacture

Process of making an all-silicon microphone

An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles. The thermopiles are interlaced so that the output of one of the thermopiles increases with increasing temperature difference between the hot and cold junctions thereof, while the output of the second thermopile decreases with increasing temperature difference between its hot and cold junctions.

Monolithically-integrated infrared sensor

Growing community of inventors

Kokomo, IN, United States of America

Timothy A Vas