Micron Technology Incorporated

Timothy A Strodtbeck

John S Molebash

Shawn D Davis

Bruce L Hayes

Rex A Smith

Mike Chalom

Jon Oliver

Ty Gabby

Ernest C Nichols

Shelby K Moore

Kevin A Larsen

Brian D Brown

Disclosed is a method for handling devices, such as reticles, in a semiconductor manufacturing environment. In one illustrative embodiment, the method includes: providing a pick comprised of a plurality of spaced-apart grippers with a pivot point between the gripper about which point the spaced-apart grippers are configured to pivot; creating a vacuum in a body proximate to the pivot point, wherein the vacuum is configured to draw particles generated in the area of the pivot into the body; and generating a magnetic force between magnets, wherein the magnetic force drives at least one gripper toward another gripper to grasp a semiconducting substrate or a reticle between the grippers.

Substrate pick

A device for handling devices, such as reticles, in a semiconductor manufacturing environment. In one illustrative embodiment, the device includes a body, a plurality of spaced-apart grippers and a plurality of magnets for producing a magnetic force to secure a semiconducting substrate or reticle between the spaced-apart grippers. In an embodiment, the magnets are surrounded by magnetic shielding.

A process and apparatus for processing a monolayer film and transferring the monolayer film to a substrate are provided. In accordance with one embodiment of the present invention, a process for transferring a monolayer film to a substrate is provided comprising the steps of: (i) providing a water-based carrier media defining an upper surface; (ii) introducing process particles on the upper surface of the carrier media, wherein the molecules are dissolved in a solvent and the particles and the solvent are insoluble in the carrier media; (iii) evaporating the solvent such that a non-cohesive monolayer film of the particles is formed on the upper surface of the carrier media; (iv) decreasing a degree of void incorporation in the monolayer film of particles by compressing a dimension of the non-cohesive film along the upper surface of the carrier media, and sonicating the carrier media to form micro-bubbles in the carrier media, wherein the compression and the sonication contribute to a decreased degree of void incorporation in the film of process particles; and (v) transferring the film of particles to a surface of the substrate. The steps of compressing and sonicating may be executed concurrently.

Sonication of monolayer films

A process and apparatus for processing a monolayer film and transferring the monolayer film to a substrate are provided. In accordance with one embodiment of the present invention, a process for transferring a monolayer film to a substrate is provided comprising the steps of: (i) providing a water-based: carrier media defining an upper surface; (ii) introducing process particles on the upper surface of the carrier media, wherein the molecules are dissolved in a solvent and the particles and the solvent are insoluble in the carrier media; (iii) evaporating the solvent such that a non-cohesive monolayer film of the particles is formed on the upper surface of the carrier media; (iv) decreasing a degree of void incorporation in the monolayer film of particles by compressing a dimension of the non-cohesive film along the upper surface of the carrier media, and sonicating the carrier media to form micro-bubbles in the carrier media, wherein the compression and the sonication contribute to a decreased degree of void incorporation in the film of process particles; and (v) transferring the film of particles to a surface of the substrate. The steps of compressing and sonicating may be executed concurrently.

A support including a plate having a top surface and a receiving hole, a lift element having a contacting end disposed through the receiving hole, a sensor disposed in a bore in the contacting end of the lift element, and a support member adjacent the top surface.

Thermal conditioning apparatus

A method of disposing a wafer on a support member protruding from a surface. The method includes supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.

A method of exhausting vapors emanating from a surface. The method includes enclosing the surface and dividing the enclosed area into a stagnant region adjacent the surface and an interior region in communication with the stagnant region. The method also includes applying a suction to the interior region and admitting air into the interior region.

A vapor control apparatus including an endless rim, a stagnation plate and a cover having an exhaust port. The endless rim has a first edge engaging the cover, a second edge opposite the first edge, an interior region and an exterior region defined by the rim and the cover, and a flow passage from the interior region to the exterior region adjacent the cover. The exhaust port is in fluid communication with the interior region and the second edge is seatable on a wafer support. A stagnation plate is disposed in the interior region, defining a stagnant region intermediate the stagnation plate and the surface, and defining at least one flow path in fluid communication with the stagnant region and the interior region.

A wafer support including a plate having a top surface and a lift element opening extending trough said plate. The support also includes a support member adjacent the top surface having a proximal end, a distal end and a bore from the proximal to the distal end and a vacuum source in communication with the bore. The support furthermore includes a lift element having a contacting end disposed through the lift element opening and a drive coupled to at least one of the plate and the lift element.

Apparatuses are provided for thermally conditioning material. The apparatus includes a plate having a top surface for receiving material, a temperature controller connected to control the temperature of the top surface of the plate and the temperature controller is controlled by a computer controller. In a preferred embodiment, three tubular shaped ceramic support members, each containing a bore, are provided to support the material and a negative pressure source is provided in fluid communication with the bores. In addition, three lift elements having contacting ends are slidably disposed through receiving holes in the thermal conditioning plate and aligned to support the material on the contacting ends. Preferably, at least one of the lift pins contains a bore with a sensor positioned to detect the presence of material on the contacting end of the lift pin and provide a signal to the computer controller that can be used to control the negative pressure source and the relative movement of the plate and lift pins. Also, in a preferred embodiment, the apparatus includes an exhausted cover providing for a stagnation region adjacent to the material during operation, thereby providing for more uniform heat transfer to the material.

The invention provides a manually operated machine for radially aligning one or more semiconductor wafers. The machine includes an elongated first 'notch' roller for rotatably engaging the edge of the wafers, a gear train, and a hand crank for manually rotating the first roller in cooperation with the gear train. The wafers are aligned according to the notches as the wafers are engaged and rotated by the notch roller until the notch in each wafer falls over and is disengaged by that roller. The manual notch finder may also include an elongated second 'position' roller for rotatably engaging the edge of the wafers. The position roller is disposed laterally near the notch roller and sized and shaped to engage the edge of the wafers fully along the periphery of each wafer so that the aligned wafers can be positioned to any degree of radial orientation. The invention also provides a combination notch or flat finder machine integrated with a wafer transfer machine. The combination machine includes a base plate, a translatable transfer arm, and a notch finder machine such as that described above, or a flat finder machine.

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Boise, ID, United States of America

Timothy A Strodtbeck