Ebullient, Inc.

Wisconsin Alumni Research Foundation

Other

Timothy A Shedd

Brett A Lindeman

Adam G Pautsch

Brian B Liu

Robert A Buchanan

Mark S Meives

Wayne L Staats

Kevin M Ripley

Terry L Hendricks

Tony P Taylor

A redundant heat sink module can include a first independent coolant pathway and a second independent coolant pathway. The first independent coolant pathway can include a first inlet chamber, a first outlet chamber, and a first plurality of orifices extending from the first inlet chamber to the first outlet chamber and providing a first plurality of impinging jet streams of coolant against a first region of a surface to be cooled when pressurized coolant is provided to the first inlet chamber. The second independent coolant pathway can include a second inlet chamber, a second outlet chamber, and a second plurality of orifices extending from the second inlet chamber to the second outlet chamber and providing a second plurality of impinging jet streams of coolant against a second region of the surface to be cooled when pressurized coolant is provided to the second inlet chamber.

Redundant heat sink module

A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir. The heat rejection loop can include a heat exchanger and a second pump. The second pump can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.

Fluid distribution unit for two-phase cooling system

Disclosed are methods and apparatuses for cooling a work piece surface using two-phase impingement, such as direct jet impingement. Preferred method include flowing a coolant through a chamber comprising a surface to be cooled by projecting a jet stream of coolant against the surface while maintaining pressure in the chamber to permit at least a portion of coolant contacting the surface to boil. Preferred apparatuses include a chamber comprising the surface and tubular nozzles configured to project a stream of coolant against the surface, a pump for forcing coolant through the tubular nozzles, a pressurizer for maintaining an appropriate pressure in the chamber, and a heat exchanger for cooling the coolant exiting the chamber. The apparatuses may further include a pressure regulator for detecting changes in temperature of the coolant exiting the chamber and communicating with the pressurizer to adjust the maintained pressure accordingly. The methods and apparatuses disclosed herein provide for effective and efficient cooling or work piece surfaces.

High efficiency thermal management system

A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.

Method of cooling series-connected heat sink modules

A heat exchanger can include a stacked array of interconnected fluid transfer members. The stacked array of interconnected fluid transfer members can include a first fluid transfer member, a second fluid transfer member, a third fluid transfer member, and a fourth fluid transfer member. The first fluid transfer member can include a liquid passageway extending lengthwise though the first fluid transfer member and a set of helical fins extending outwardly from an outer surface of the first fluid transfer member and rotating along a length of the first fluid transfer member. The stacked array of interconnected fluid transfer members can form a jointless structure.

Heat exchanger with interconnected fluid transfer members

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

Flexible two-phase cooling system

A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.

Method of absorbing sensible and latent heat with series-connected heat sinks

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

Microprocessor assembly adapted for fluid cooling

A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.

Heat sink module

A method of operating a cooling apparatus is described that allows flexible cooling lines connecting an inlet manifold to an outlet manifold to be safely added or removed during operation of the cooling apparatus without causing unstable two-phase flow. The method can include providing a cooling apparatus having an inlet manifold, an outlet manifold, and a bypass extending from the inlet manifold to the outlet manifold. Each manifold can include a plurality of connection ports, such as quick-connect couplers, to accommodate adding and removing cooling lines between the inlet manifold and the outlet manifold. The method can include providing a flow rate of single-phase liquid coolant to the inlet manifold and setting a pressure regulator in the bypass to provide a certain flow rate through the bypass. The flow rate through the bypass can be determined as a function of an average flow rate through each of the cooling lines.

Method of operating a cooling apparatus to provide stable two-phase flow

A cooling system and method that significantly improves spray evaporative cooling by using arrays of slot or plane sprays to create coverage of the entire heated surface to be cooled without allowing interaction between plumes that are spraying from the nozzles. The sprays are directed at an angle to the surface to take advantage of the high droplet momentum possessed by the spray to direct a flow of coolant fluid across the surface toward desired draining points, thereby enabling drainage regardless of the orientation of the unit.

Full coverage spray and drainage system and method for orientation-independent removal of high heat flux

A cooling system and method that significantly improves spray evaporative cooling by using a mixture of cooling fluids having different boiling points. The cooling fluid mixture is sprayed onto a surface to be cooled. Efficient cooling with reduced cooling fluid volume is provided by both evaporation of the more volatile component of the mixture as well as heating of the less volatile component which remains in contact with the surface being cooled. More uniform temperatures across the surface being cooled and a reduced risk of potentially damaging critical heat flux is achieved.

Multi-mode fluid cooling system and method

An emulsion tube for a carburetor is formed with a porous wall surrounding an inner passage, wherein air travels about one side of the wall and fuel travels about the opposite side, with air being supplied through the pores to aerate the fuel (with the aerated fuel then being expelled into a venturi wherein engine intake air is traveling to further mix the fuel with the intake air therein). The emulsion tube can beneficially provide a high degree of fuel/air mixing across the entire range of intake airstream flow rates at which an engine may operate. The porosity of the emulsion tube can also be tailored to provide the desired fuel/air ratio(s) across the engine's operational range of intake airstream flow rates.

Growing community of inventors

Middleton, WI, United States of America

Timothy A Shedd