Fci Americas Technology Inc.

Berg Technology, Inc.

E.i. Dupont De Nemours and Company

Amp LLC

Z-plane, Inc.

Other

Fci, Inc.

Fci Asia Pte. Ltd.

Lemke, Timothy A.

Timothy A Lemke

Timothy W Houtz

Stephen B Smith

Joseph Blair Shuey

Gregory A Hull

Lewis Robin Johnson

Clifford L Winings

Steven E Minich

Stanley W Olson

Richard A Elco

Stefaan Hendrik Josef Sercu

David F Fusselman

Stefaan Hendrik Jozef Sercu

Charles M Gross

Robert Charles Swengel, Sr

Donald K Harper, Jr

Larry Eugene Dittmann

Stefaan Sercu

Charles C Byer

John R Ellis

Kenneth A Neidert

Ronald Clarence Hoffman

Charles R Gingrich

Frederick Phillip Villiard

Edmond Franklin Shultz, Jr

Joseph B Shuey

Lewis R Johnson

Gregory S Hull

An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane.

Crosstalk reduction

Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume. As a result of these features, substantial coplanarity of the BGA array along the mounting interface of the connector is achieved.

High density connector and method of manufacture

A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane. The clearance contains air that serves as a dielectric to increase the impedance between adjacent signal holes, and thereby to reduce crosstalk and other problems associated with close proximity between signal holes. Additional through holes provide additional impedance at locations between adjacent conductor through holes. Such additional through holes for impedance control can be included in the circuit boards as well as the backplane.

Interconnection assembly for printed circuit boards

An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.

Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

An electrical connector according to the invention may include a first signal contact that defines a first side and a first edge, wherein the first side is greater in length than the first edge, the first edge having a first edge width, and a second signal contact that defines a second side and a second edge, wherein the second side is greater in length that the second edge, the second edge having a second edge width. The first signal contact and the second signal contact may be positioned edge-to-edge. A gap may be defined between the first edge of the first signal contact and the second edge of the second signal contact. The gap may have a gap width that is approximately equal to at least one of the first edge width and the second edge width. The connector may have a column pitch, and the gap width may be based on the column pitch. The gap width may be approximately 0.3-0.4 millimeters.

Electrical connectors having differential signal pairs configured to reduce cross-talk on adjacent pairs

An electrical connector having a leadframe housing, a first electrical contact fixed in the leadframe housing, a second electrical contact fixed adjacent to the first electrical contact in the leadframe housing, and a third electrical contact fixed adjacent to the second electrical contact in the leadframe housing is disclosed. Each of the first and second electrical contacts may be selectively designated, while fixed in the lead frame housing, as either a ground contact or a signal contact such that, in a first designation, the first and second contacts form a differential signal pair, and, in a second designation, the second contact is a single-ended signal conductor. The third electrical contact may be a ground contact having a terminal end that extends beyond terminal ends of the first and second contacts.

Shieldless, high-speed electrical connectors

An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array includes a first differential signal pair, a first ground contact lead adjacent to the first differential signal pair, and a second ground contact lead adjacent to the first ground contact lead. The second linear array is positioned adjacent to the first linear array, and includes a second differential signal pair, a third ground contact lead adjacent to the second differential signal pair, and a fourth ground contact lead adjacent to the third ground contact lead. The electrical connector is devoid of electrical shields between the first linear array and the second linear array.

An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array is arranged in a first pattern of signal contacts and ground contacts. The second linear array is arranged in a second pattern of signal contacts and ground contacts that is different from the first pattern. The signal contacts define differential signal pairs. The signal contacts in the first linear array are elongated along a direction along which the first linear array extends.

An electrical connector that includes a linear array of electrical blade contacts is disclosed. Each contact may have a free-ended mating portion that extends from a mate surface of a dielectric base. The first linear array may include a first signal contact, a second signal contact positioned adjacent to the first signal contact and forming a differential signal pair therewith, and a ground contact positioned adjacent to the second signal contact. The first signal contact, the second signal contact, and the ground contact may each be elongated in a direction along the linear array.

Lightweight, low-cost, high-density electrical connectors are disclosed that provide impedance-controlled, high-speed, low-interference communications, even in the absence of shields between the contacts, and that provide for a variety of other benefits not found in prior art connectors. An example of such an electrical connector may include a first signal contact positioned within a first linear array of electrical contacts and a second signal contact positioned within a second linear array of electrical contacts that is adjacent to the first linear array. Either of the signal contacts may be a single-ended signal conductor, or one of a differential signal pair. The connector may be devoid of shields between the signal contacts, and of ground contacts adjacent to the signal contacts.

Growing community of inventors

Dillsburg, PA, United States of America

Timothy A Lemke