Pac Tech&#x2014;packaging Technologies Gmbh

Timo Kubsch

Matthias Fettke

Andrej Kolbasow

Gero Bonow

A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.

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Berlin, Germany

Timo Kubsch