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Timo Koivuluoma

Bruno Agostini

Thomas Gradinger

Heinz Lendenmann

Mathieu Habert

Jorma Manninen

Thomas Wagner

Jukka Tiittanen

Francesco Agostini

Daniele Torresin

Mika Silvennoinen

Tor Laneryd

Matti Laitinen

Esa Virtanen

Matti Smalen

Martti Juurioksa

Risto Laurila

Marko Harju

Timo Väätäinen

Roman Jauhonen

Vesa Koistinen

Jouko Siirilä

Anna Rumpunen

An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

Arrangement for subsea cooling of semiconductor modules

A cooling apparatus is disclosed with a base plate for receiving a heat load from an electric component, an evaporator, a condenser, and a connecting piece for passing fluid from the evaporator to the condenser. In order to efficiently fill the evaporator, the cooling apparatus is provided with a pump for pumping fluid from the condenser to the evaporator.

Cooling apparatus with multiple pumps

A pressure compensated subsea electrical system and a pressure compensated subsea electrical system which has a housing filled with a dielectric liquid. The housing has a first housing portion and a second housing portion in pressure communication with each other. The first housing portion includes a transformer, and the second housing portion includes a power converter. The pressure compensated subsea electrical system includes a pressure compensator arranged to compensate pressure inside the housing. The pressure compensator is enabled to compensate pressure in both the first housing portion and the second housing portion.

Pressure compensated subsea electrical system

A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Cooling assembly and method for manufacturing the same

Exemplary embodiments are directed to an equipment space that is a closed space provided with electrical equipment and an air dryer condensing the moisture of the air in the equipment space into water. A system for removing water from the equipment space includes a porous element having a capillary structure and being located in an outlet opening of the equipment space. The porous element is connected such that water condensed by the air dryer is directed to a first inner surface of the porous element. The capillary structure of the porous element is configured to propogate water from the inner surface of the porous element to an outer surface of the porous element. The outer surface of the porous element is configured to release water to ambient air outside the equipment space.

Arrangement for removing water from an equipment space

An arrangement and a method are provided in connection with a solar energy system. The arrangement includes solar panels and a converter for converting the DC voltage from the solar panels. The converter is arranged inside a container or a similar closed structure. The arrangement includes means for producing heat from the energy produced by the solar panels. The means are arranged inside the container or a similar closed structure and are electrically connectable to the solar panels.

Method and an arrangement in connection with a solar energy system

A cooling assembly is disclosed having a device chamber, a cooling chamber, a heat exchanger, a fan and a controller, the heat exchanger having a first heat exchanger unit and a second heat exchanger unit located above the first heat exchanger unit. The fan includes a first fan adapted to generate a first cooling air flow. The cooling assembly further includes a first dust tray located between the first heat exchanger unit and the second heat exchanger unit, the first cooling air flow being directed towards the first dust tray. The first dust tray is adapted to receive and retain at least part of contaminant particles present in the first cooling air flow, the device chamber being separated from the cooling chamber.

Cooling assembly

A method and arrangement are provided for reducing the amount of condensed moisture inside an enclosure which encloses at least one piece of electrical equipment which is configured to receive electric power from outside the enclosure in a first electrical magnitude range (0 . . . max) and to feed electric power to outside the enclosure in a second electrical magnitude range (min. . . max). Electric power received on at least one portion (a, b, c) of the first electrical magnitude range (0 . . . max) being outside the second electrical magnitude range (min. . . max) is utilized for heating the condensed moisture for exhaustion thereof.

Method and arrangement for reducing the amount of condensed moisture inside an enclosure for electrical equipment

A cooled base plate is provided for electric components. A first side of the cooled base plate is provided for attaching exothermal electric components thereto. On a second side of the base plate, opposite to the first side, there is embedded a cooling channel system having a cooling fluid inlet at a first end of the base plate and a cooling fluid outlet at a second end of the base plate. In order to minimize differences in temperature between the electric components, the thickness of the base plate increases in the direction from the inlet of the cooling channel system towards the outlet of the cooling channel system, e.g., in the flow direction of the cooling fluid, for at least a portion of the length of the base plate.

Cooled base plate for electric components

This disclosure relates to a cooling structure for an electronic device including an inlet for conveying a flow in a first flow direction towards a first component and an outlet for conveying the flow further. To deter dirt particles from proceeding to electronic components, the cooling structure can include a second flow channel, which starts from a port oriented transversely to the first flow direction or away therefrom and receives part of the flow from the inlet, and which conveys the part of the flow to an electronic component located in the second flow channel.

Growing community of inventors

Vantaa, Finland

Timo Koivuluoma