Imbera Electronics Oy

Imberatek, LLC

Ge Embedded Electronics Oy

Timo Jokela

Antti Iihola

Petteri Palm

Risto Tuominen

This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

Method for manufacturing an electronic module and electronic module

This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (). At least one recess () is made in the sheet () and extends through the insulating-material layer () as far as the conductive layer on the opposite surface (). A component () is set in the recess, with its contact surface towards the conductive layer and the component () is attached to the conductive layer. After this, a conductive pattern () is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component () set in the recess.

Method for manufacturing an electronic module

Method for manufacturing an electronic module, which electronic module includes a component (), which is connected electrically to a conductor-pattern layer (). In the method contact openings () are made in the conductor layer (), the mutual positions of which correspond to the mutual positions of the contact areas () of the component (). After this, the component () and the conductor layer () are aligned relative to each other, in such a way that the contact areas () of the component () come to the positions of the contact openings (), and the component () is secured. After this, at least in the contact openings () and the contact areas () of the component () a conductor material is made that connects the component () to the conductor layer (). After the making of the contact the conductor layer () is patterned to form a conductor-pattern layer ().

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Halikko, Finland

Timo Jokela