Evonik Technochemie Gmbh

Evonik Degussa Gmbh

Evonik Operations Gmbh

Tim Pohlmann

Sergey Evsyukov

Horst Stenzenberger

Matthijs Ter Wiel

The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein Rsignifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein Rsignifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein Rsignifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein Rsignifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites. 

Asymmetrically substituted bis-alkenyl diphenyl ethers, their preparation and use

A compound according to formula (I) can be part of a heat-curable resin composition based on polymaleimide resin systems comprising such compound as co-monomer: wherein D is an x-functional group; and x is an integer &#x2265;2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. A crosslinked resin is obtainable by curing such composition. The compounds can be used in structural adhesives, matrix resins for fiber prepregs, moulding compounds, and structural and/or electrical composites.

[(2-ethoxy-5-trans-1-propen-1-yl)-phenoxyl]-terminated compounds

The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein Ris hydrogen or an alkenylphenoxy group, Ris an alkenylphenoxy group, and Ris hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to cross-linked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, molding compounds, as well as structural and/or electrical composites. 

Alkenylphenoxy-substituted 1,1-diphenylethylenes, processes for their preparation, and their use

The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.

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Nidderau, Germany

Tim Pohlmann