Micron Technology Incorporated

Tim Murphy

Lee Gotcher

Timothy L Jackson

A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.

Method and system for electrically coupling a chip to chip package

The disclosed system and method data increases data transmission speed through a memory system by using optical signals comprising a plurality of wavelengths of light so that each pulse of optical signals can represent more than a single bit of data. An optical transmitter comprises multiple, separately controllable light-emitting sections which generate light at different wavelengths. A photoreceptor, comprising sections of materials responsive to light received at different wavelengths, provides an output signal corresponding to the light signals received at the different wavelengths. The photoreceptor therefore can decode the received optical signals into a multiple bit output sequence corresponding with the multiple bit sequence originally transmitted. The disclosed method and system can be used to communicate signals between a plurality of memory devices and a memory hub within a memory module or directly to a system memory controller, and/or between a plurality of memory hubs and a system memory controller.

System and method for multiple bit optical data transmission in memory systems

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and witch extend from an active surface to a back surface of the semiconductor substrate. The redistrobution patterns are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.

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Boise, ID, United States of America

Tim Murphy