Cascade Microtech, Inc.

Sharp Laboratories of America, Inc

Formfactor, Inc.

Tim Lesher

K Reed Gleason

John T Martin

Mike Andrews

John L Dunklee

Eric W Strid

Leonard A Hayden

Amr M E Safwat

Peter McCann

Anthony James Lord

Rod Jones

Terry Burcham

Craig Stewart

Jeff Spencer

David Newton

Jason William Cosman

Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.

Multi-conductor transmission line probe

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Probe for testing a device under test

A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Chuck for holding a device under test

Shielded probe for testing a device under test

A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

A chuck that includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.

A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Shielded probe with low contact resistance for testing a device under test

A shielded probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe may include a probe tip that extends through a dielectric substrate that supports on a first surface a signal path to test instrumentation and on a second surface a ground path that shields both the signal path and the probe tip.

Shielded probe for high-frequency testing of a device under test

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path extending between the first and second surfaces of a membrane and a probe contact electrically connected to the conductive path.

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path between the first and second sides of a substrate and a probe contact electrically connected to the conductive path.

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Portland, OR, United States of America

Tim Lesher